本論文共分三個部分：第一個部分探討不同的黏著層包括鈦(Ti)及鉭(Ta)對於鉭酸鍶鉍(SBT)薄膜的微結構以及鐵電特性的影響。實驗後發現若是以Ti作為黏著層，沈積在上面的鉑(Pt)底電極會有較粗糙的顯微結構，且Ti原子會擴散至Pt底電極表面生成二次相，導致最後的SBT薄膜鐵電特性比較差。另一方面，以Ta為黏著層的SBT薄膜則是會有比較好的顯微結構以及鐵電特性。
本文的第二個部分是延伸第一個部分的結論：由於黏著層原子的擴散導致薄膜顯微結構與鐵電特性的變化。為了更進一步探討擴散原子的影響，加入Ta晶種層(seeding layer)於Pt底電極之上SBT鐵電薄膜之下來模擬擴散原子所造成的影響。實驗結果顯示加入晶種層的厚度會影響之後微結構及鐵電特性的表現，某一定厚度的晶種層會具有最好的效果。

本文最後一個部分會利用液態源霧化沈積系統(LSMCD)來沈積SBT薄膜，探討SBT鐵電薄膜厚度與鐵電性質之間的關係。在一定的退火溫度下，SBT薄膜厚度太小或太大都會影響結晶特性及鐵電特性，只有在特定範圍的厚度才具有最佳的結果，而且相較於溶凝膠(Sol-Gel)法，LSMCD沈積之SBT薄膜具有更佳的鐵電特性。

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