本研究致力於整合奈米壓印製程於可撓式基板上，製作奈微米結構於PET/ITO基板，並利用此技術製作有機薄膜電晶體，且針對製作出的有機薄膜電晶體之半導體特性進行量測與分析。
第一階段利用FOTS脫模劑對模仁表面進行處理，研究讓模仁表面能降低之最佳參數，使壓印製程能達到無沾黏的效果。另外利用模仁進行壓印研究，找出微米及奈米線寬之最佳壓印參數，並且使用透明基板解決紫外光成型奈米壓印技術中，透明模仁製作困難及製作成本高等問題。
第二階段製作有機薄膜電晶體於可撓式基板上，期望利用最簡單的製程以及較低的成本，實現具有量產及高良率的元件製造方式。本研究利用奈米壓印技術製作有機薄膜電晶體，期望在製作電子元件上開拓出全新的領域，並且提升奈米壓印製程之實際應用價值。

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