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研究生: 陳國岳
Kow-Yuen Chen
論文名稱: 快閃記憶體多重邏輯操作與可靠度研究
Multilevel Flash Memory Operation Method and Reliability
指導教授: 張廖貴術
Kuei-Shu Chang-Liao
口試委員:
學位類別: 碩士
Master
系所名稱: 原子科學院 - 工程與系統科學系
Department of Engineering and System Science
論文出版年: 2003
畢業學年度: 91
語文別: 中文
中文關鍵詞: 多重邏輯
外文關鍵詞: Multilevel, Flash
相關次數: 點閱:78下載:0
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  • 摘要
    快閃記憶體在目前被廣泛的應用在各項電子產品中,其易於存取、低功率及非揮發性等特質了大多數產品的需求,但其製程複雜,元件微縮不易。因此在操作的模式上,多重邏輯是一個可以考慮的方向。

    在快閃記憶體中的寫入機制,通道熱電子寫入的優點是寫入後臨限電壓(Vth)分佈收斂及臨限電壓和閘極電壓(Vg)成正比。我們利用這二個特性建立多重邏輯。在多重邏輯抹除,由於FN抹除收斂性質並不佳,故造成最低態位元分散,這對建立多重邏輯是不利的。本篇論文嘗試利用二階段抹除(2 Step Erase)加以改進,達到每一個臨限電壓分佈區收斂,以達到充分利用工作區(Working Window)並得到最佳的State和State相隔距離。同時二階段抹除在耐力(Endurance)測試中也充分表現其優點。在多重邏輯的操作中,所遇到最大問題是位元線干擾(Bit line disturb or Drain disturb),其次為字元線干擾(Word line disturb or Gate disturb),本篇論文也提出新的寫入方式改善位元線干擾。同時也對新的寫入方式的可靠度分析和傳統通道熱電子寫入作比較。


    第一章 緒論……………………………………………………....….... 1 1-1緒言…………………………………………………....….. 1 1-2論文簡介…………………………………………........….. 2 第二章 快閃記憶體的工作原理………………………….....………....4 2-1快閃式記憶體基本介紹……………………......………… 4 2-1-1閘極耦合參數量測……...……………......………… 5 2-1-2快閃記憶體陣列..........................................................6 2-1-2-1 NOR組態的快閃記憶體陣列.......................6 2-1-2-2 AND組態的快閃記憶體陣列.......................8 2-1-2-3 NAND組態的快閃記憶體陣列....................8 2-2 寫入與抹除機制(Program/Erase Mechanisms).................10 2-2-1 通道熱電子注入 (Channel Hot Electron Injection)10 2-2-2 F-N穿隧寫入(Fowler-Nordheim Tunneling)............12 2-2-3 F-N穿隧擦拭(Fowler-Nordheim Tunneling Erase)...12 2-3 快閃記憶體的可靠度.........................................................13 2-3-1 耐力(endurance)........................................................13 2-3-2資料保存(Data Retention)....................................14 2-3-3單元干擾(Cell Disturbs).......................................14 2-4 多重邏輯的概念...................................................................15 第三章 快閃記憶體多重邏輯的建立....................................................29 3-1 Fowler-Nordheim Tunneling寫入方式............................29 3-2 通道熱電子注入(Channel Hot Electron Programming)....31 3-2-1 汲極電壓的選擇.....................................................32 3-2-2 閘極電壓選擇.........................................................33 3-2-3寫入時間的選擇......................................................34 3-3 抹除(Erase).........................................................................35 3-4 多重邏輯初步建立..........................................................38 3-5 結論....................................................................................39 第四章 運用二階段抹除改善臨限電壓分布........................................52 4-1 不均勻抹除 (Non uniform Erase)與過度抹除 (over erase)..................................................................................52 4-2 兩階段抹除: 第二階段利用F-N 寫入(Step 2 Use Fowler-Nordheim Tunneling)..................................................................56 4-3 兩階段抹除: 第二階段利用CHE 寫入(Step 2 Use Channel Hot Electron Injection)..............................................................57 4-3-1第一階段抹除電壓選擇............................................58 4-3-2軟性寫入閘極電壓的選擇........................................59 4-3-3第二階段軟性寫入時間的選擇................................60 4-3-4實際應用....................................................................61 4-5二階段抹除的優點...............................................................62 4-6結論.......................................................................................64 第五章 多重邏輯的可靠度分析............................................................75 5-1 讀取干擾(Read disturb)........................................................75 5-2 閘極干擾(Gate disturb)........................................................77 5-3 汲極干擾(Drain disturb)......................................................79 5-4元件耐力(Endurance)............................................................81 5-5 結論.......................................................................................83 第六章 新的寫入方式以避免汲極干擾................................................95 6-1 增加垂直電場(Vertical field)........................................95 6-2 增加水平電場(lateral field)..........................................97 6-3 可靠度分析.......................................................................101 6-4 結論...................................................................................105 第七章: 結論.........................................................................................116 參考資料................................................................................................119

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