感測器技術在現代工業與家庭生活已成為緊密連結的高科技產品，隨著智慧電子產品與精密製造產品日益增加，非接觸式感測原理具高靈敏度與無損待測物受到高度重視。銅薄膜作為高密度邏輯半導體製程的導體材料，薄膜厚度控制對整體產品良率具有關鍵性影響。然而，傳統檢測技術如接觸式探針法，或光學檢測法操作成本高與設備複雜而急需改善。本論文旨在設計基於渦電流原理的非接觸式檢測系統，克服渦電流計算之複雜性，嘗試研究銅薄膜厚度之精密量測。
研究初期，先以電磁學基礎理論探討薄片之渦電流現象，透過美國Ansys公司之Maxwell 2D/3D®有限元素分析套裝軟體，進行不同厚度薄片在提升距離變化下阻抗響應之分析，進而優化感測線圈設計，提升靈敏度與穩定性。實驗驗證則採用市售商用平繞感測線圈，針對不同厚度銅箔樣本，進行多次變更提升距離，量測電阻與電感值，並繪製提升曲線以提取其斜率。最後，本研究驗證渦電流感測器於微米厚度範圍，具高線性度及響應特性，展現非接觸式厚度量測於銅質薄膜之應用潛力。

Sensor technology has been progressively evolved into high-tech products in modern industrial and daily life environment. With the increasing demands for electronic products and precision manufacturing, non-contact measurement methods have attracted growing attention due to their high sensitivity and non-destructive natures. Copper thin films as processing stage in modern semiconductor industry depend on thickness control to ensure final products yields. Conventional methods like contact probes or optical techniques have limitations due to surface damage, cost, or environmental sensitivity. The objective of thesis is to develop an eddy current based non-contact system for effective thickness measurement.
Based on electromagnetic theory, the investigation uses finite element analysis copyrighted by Ansys Inc., namely Maxwell 2D/3D®, to simulate impedance responses under different lift-off distances and optimize coil design for better sensitivity and stability. Commercially available planar spiral coils were employed for measurements of resistance and inductance across varying lift-off distances on copper thin films of various thicknesses. Lift-off curves were plotted and their slopes extracted. Final results confirm good linearity in the micrometer range, demonstrating the system’s potential for non-contact thickness measurement of copper films.