本研究以國內某12吋晶圓製造廠之自動化物料搬運系統(AMHS)為對象，探討interbay與intrabay系統軌道直接整合的環境下，搬運車的管理及其運作策略問題。其中提出三種運作策略，固定車型環境、虛擬車型環境、動態搬運車環境，並利用系統模擬及實驗設計的技術，評估出較合適的運作策略，以作為晶圓廠規劃之參考。
首先本研究針對interbay與intrabay整合後的搬運系統進行搬運行為的探討。經分析後，發現自動化物料搬運系統中的搬運車可以「區分」與「不區分」活動範圍的方式來完成任務，進一步分別針對「區分」與「不區分」活動範圍的搬運車活動型態，進行面臨問題的分析，並提出可行的搬運車運作策略。

在搬運車「區分」活動範圍方面，延續吳(2001)所提出以搬運車區分”車型”的概念來區分活動範圍，除維持原先所提出之「固定車型環境」外，並進一步提出”虛擬共用”觀念的管制稱為「虛擬車型環境」。經實驗分析結果顯示，因為「虛擬車型環境」是根據系統中各車型車數的使用狀況，再指派搬運車車型，如此可以指派到較近且無任務之空搬運車，因此有較佳的搬運績效表現。

在搬運車「不區分」活動範圍方面，則提出「動態搬運車環境」，此運作策略的主要重點為，(1)避免交通死鎖或壅塞，(2)是否需避免intrabay系統真空。因此提出intrabay及interbay系統”上、下限車數”的設定方式。經實驗分析結果顯示，intrabay及interbay系統上限車數分別設為”同一時間內，intrabay系統中之機台所能進行load/unload晶舟的port數量”、”interbay系統軌道區段(zone)數減1，及下限車數設為0，有較佳績效。

最後將「區分」與「不區分」活動範圍之最佳運作策略，以方案評估的方式進行比較，發現因為動態搬運車環境有較彈性的派車方式，因此有較佳的績效表現。

1.1998自動化與企業經營國際研討會，民國87年。
2.王志宏，“無人搬運車系統之智慧型派車機構之研究”，清華大學工業工程研究所碩士論文，1993。
3.呂博裕與王福琨，“晶圓製造廠自動化物料搬運與儲存系統之模擬分析”, 工業工程學刊，第十六卷，第二期，頁183-194，1999。
4.吳俊寬，”晶圓廠連接式自動化物料搬運系統搬運策略之模擬研究”，清華大學工業工程與工程管理所碩士論文，2001。
5.林則孟，系統模擬理論與應用，滄海書局，2001。
6.林巧雲，”區域式無人搬運車系統之動態負載排程問題”，清華大學工業工程研究所碩士論文，1994。
7.林靖智，“模組化晶圓製造廠物料搬運系統之設計”，交通大學工業工程研究所碩士論文，1999。
8.周上傑，“晶圓廠自動化物料搬運系統之派車模擬研究”，清華大學工業工程研究所碩士論文，1999。
9.郭曜賑，“UML為基礎之物件導向模擬模式發展程序方法論-晶圓廠自動物料搬運系統為例”，清華大學工業工程研究所碩士論文，1999。
10.陳紹偉，“12吋IC代工廠自動化物料搬運系統之系統模擬與派工法則的研究”，台灣大學機械工程研究所碩士論文，1999。
11.電子時報，半導體趨勢圖示，大椽股份有限公司，2000。
12.電子時報，矽導新勢力-半導體與零組件產業趨勢，大椽股份有限公司，2002。
13.劉名曜、朱慧明，”昇級8吋晶圓廠房為12吋晶圓廠房的設施規劃之最佳方案”，中國工業工程學會九十年度年會暨學術研討會，2001。
14.顏柄榮，“半導體晶圓廠自動化物料搬運系統之模擬分析”，清華大學工業工程與工程管理所碩士論文，2000。
15.羅世侖，”區域式與網路式無人搬運車系統之比較”，雲林技術學院工業工程與管理技術所碩士論文，1996。
16.Amurray, S., Mackulak, Gerald T., Fower, John W., and Colvin, T., “A Simulation-Based Cost Modeling Methodology for Evaluation of Interbay Material Handling in A Semiconductor Wafer Fab”, Proceeding of the 2000 Winter Simulation Conference, pp.1510-1517, 2000.
17.Brain, M., Gould R., Kaempf, U., and Wehrung, B., “Emerging Needs for Continuous Flow FOUP Transport”, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, pp.76-82, 1999.
18.Binder, H., Honold, A., “Automation and fab concepts for 300mm wafer manufacturing”, Microelectronic Engineering 45, pp91-100, 1999.
19.Brain, M., Abuzeid, S., Ph.D., “Minienvironment Technology and Automation Systems for Next Generation IC Fabs”, International Symposium on Semiconductor Manufacturing, pp.173-178, 1994.
20.Campbell, P. L., and Laitinen, G., “Overhead Intrabay Automation and Microstocking- a Virtual Fab Case Study”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, pp.368-372, 1997.
21.Cardarelli, G., Marcello, P. M., and Granito, A., “Performance Analysis of Automated Interbay Material Handling and Storage Systems for Large Wafer Fab”, Robotics & Computer-Integrated Manufacturing, Vol.12, No.3, pp.227-234, 1996.
22.Cheng, T. C. E., ”A Simulation Study of Automated Guided Vehicle Dispatching”, Robotics and Computer-Integrated Manufacturing, Vol.3, No.3, pp.335-338, 1987.
23.Chrisos, J., Nestel-Patt, J., “Integration Risks in 300-mm Wafer Fab Automation”, Solid State Technology, Vol.41, No.7, pp.193, 196, 198, 200, 202, 1998.
24.Egbelu, P. J., ” Pull Versus Push Strategy for Automated Guided Vehicle Load Movement in a Batch Manufacturing System”, Journal of Manufacturing System, Vol.6, No.3, pp.271-280, 1987.
25.Egbelu, P. J. and Tanchoco, J. M. A., ” Characterization of Automated Guided Vehicle Dispatching Rules”, International Journal of Production Research, Vol.22, No.3, pp.359-374, 1984.
26.Egbelu, P. J., “The use of non-simulation approaches in estimating vehicle requirements in an automated guided vehicle based transport system”, Material flow, Vol.4, pp.17-32, 1987.
27.Fu, H.-S., Liao D.-Y., ”An Effective OHT Dispatching Policy for 300mm AMHS Management,” to appear in the Proceedings of SEMICON TAIWAN 2001, Taipei, Taiwan, September 2001.
28.Gaxiola, G., Hennessy, L., “Evaluation of advantages of integrating 300mm AMHS Fab Layouts in the photo area”, IEEE, pp.373-376, 2001.
29.Garry, A. K., “Automatic guided vehicle systems:application, controls and planning”, Material flow, Vol.4, pp.3-16, 1987.
30.Klein, C. M. and Kim, J., ”AGV Dispatching”, International Journal of Production Research, Vol.34, No.1, pp.95-110, 1996.
31.Kurosaki, R., Nagao, N., Komada, H., Watanable, Y., and Yano, H., “AMHS for 300mm Wafer”, IEEE International Symposium on Semiconductor Manufacturing Conference, pp.D-13-D16, 1997.
32.Kobayashi, S., Tokunaga, K., Kobayashi, Y., Kato, K., and Minami, T., “Particle Characteristics of 300mm Minienvironment (FOUP&LPU)”, IEEE, pp39-42, 1999.
33.Lee, C. C. and Lin, J. T., “Deadlock prediction and avoidance based on Petri nets for zone control automated guided vehicle systems”, International Journal of Production Research, Vol.33, No.12, pp.3249-3265, 1995.
34.Liu, C. M., and Duh, S. H., ”Study of AGVS Design and Dispatching Rules by Analytical and Simulation Methods”, International Journal of Computer Intergrated Manufacturing, 5(4Ɓ), pp.290-299, 1992.
35.Mackulak, G. T., Lawrence, F. P., and Rayter J. “Simulation Analysis of 300mm Intrabay Automation Vehicle Capacity Alternatives”, 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.445-450, 1998.
36.Mackulak, G. T., Savory, P., “A Simulation-Based Experiment for Comparing AMHS Performance in a Semiconductor Fabrication Facility”, IEEE Transactions on Semiconductor Manufacturing, Vol.14, No.3, pp.273-280, 2001.
37.Maxwell, W. L., Muckstadt, J. A., “Design of automatic guided vehicle systems,” IIE Transactions, Vol. 14, No. 2, pp.114-124, 1982.
38.Mantel, R. J., Landeweerd, H. R.A., “Design and operational control of an AGV system”, International Journal of Production Economics, Vol. 41, pp.257-266, 1995.
39.Nadoli, G., Pillai, D, “Simulation in Automation Material Handling Systems Design for Semiconductor Manufacturing”, Proceeding of the 1994 Winter Simulation Conference, pp.892-899, 1994.
40.Oboth, C., Batta, R. and Karwan, M., “Dynamic conflict-free routing of automated guided vehicles”, International Journal of Production Research, Vol.37, No.9, pp.2003-2030, 1999.
41.Pillai, D., Quinn, T., Kryder, K., and Charlson, D., “Integration of 300mm Fab Layout and Material Handling Automation”, ISSM Paper, San Jose, CA. 1999.
42.Pillai, D., Srinivasan, S. R., “Material Handling Automation-Trends, Vision, and Future Plans” Proceedings from ISSM ’96, Tokyo, Japan
43.Pierce, N. G., Stafford R., “Modeling and Simulation of Material Handling for Semiconductor Wafer Fabrication”, Proceedings of the 1994 Winter Simulation Conference, pp.900-906, 1994.
44.Pierce, N. G., Stafford R., “Simulation AMHS Performance for Semiconductor Wafer Fabrication”, IEEE/UCS/SEMI International Symposium on Semiconductor Manufacturing, pp.165-170, 1995.
45.Peters, B. A., Yang, T., “Integrated Facility Layout and Material Handling System Design in Semiconductor Fabrication Facilities”, IEEE Transactions on Semiconductor manufacturing, Vol.10, No.3, pp.360-369, 1997.
46.Plata, J.J., “300 mm Fab Design-A Total Factory Perspective”,1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings , pp.A5-8, 1997.
47.Subramaniam, B., Kryder, K. D., “Automation Challenges In The NextGeneration Semiconductor Factory”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp349-355, 1997.
48.Schulz, M., Stanley, Timothy D., and Renelt, B., “Simulation Based Design Support for Future 300mm Automated Material Handling”, Proceeding of the 2000 Winter Simulation Conference, pp.1518-1522, 2000.
49.Tanchoco, J. M., Egbelu, P. J. and Taghaboni, F., “Determination of the total number of vehicles in an AGV-based material transport system”, Material Folw, Vol.4, pp.33-51, 1987.
50.Ulrich Kaempf, “Automated Wafer Transport in the Wafer Fab”, 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.356-361, 1997.
51.Weiss, M., “Semiconductor Factory Automation”, Solid State Technology, Vol.39, No.1, pp.89-90, 92, 95-96, 1996.
52.Weiss, M., “300mm Fab Automation Technology Options and Selection Criteria”, 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference Workshop, pp373-379, 1997.
53.Weiss, M., “New Twists on 300mm Fab Design and Layout”, Semiconductor International, Vol.22, No.8, pp. 103-4, 106, 108 , 1999.
54.Yang, T. H., Lin, L. R. , Hsu, K. H., and Chen, T., “Implementation Experience of Automated Guided Vehicle System in an IC Foundry Fab around SMIF Environment”, Semiconductor Manufacturing Technology Workshop, pp.182-186, 1998.
55.Yim, D. S. and Linn, R. J. ” Push and Pull Rules for Dispatching Automated Guided Vehicles in a Flexible Manufacturing System”, Internal journal of Production Research, Vol.31, No.1, pp.43-57, 1993.