簡易檢索 / 詳目顯示
| 研究生： |
范嘉偉 Chia-Wei Fan |
|---|---|
| 論文名稱： |
無鉛/錫鉛銲點之金屬間化合物成長機制及潛變特性 Growth Mechanism of Intermetallic Compound and Creep Behavior of Lead-free/Lead-containing Solder Joints |
| 指導教授： |
葉銘泉博士
Dr. Ming-Chuen Yip |
| 口試委員: | |
| 學位類別： |
碩士 Master |
| 系所名稱： |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
| 論文出版年： | 2004 |
| 畢業學年度： | 92 |
| 語文別： | 中文 |
| 論文頁數： | 173 |
| 中文關鍵詞： | 金屬間化合物 、擴散係數 、剪力推球強度 、破壞模式 、穩態潛變率 |
| 外文關鍵詞： | intermetallic compound, diffusion coefficient, ball shear strength, failure mode, steady-state creep rate |
| 相關次數： | 點閱：106 下載：0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本文的研究範圍著重在IMC實驗及潛變實驗。IMC實驗主要為探討63Sn-37Pb、Sn-3.5Ag和Sn-4Ag-0.5Cu三種錫球迴焊至Au/Ni/Cu表面處理的銲墊後，銲點界面IMC層的成長狀況。除了將量測銲點經等溫時效作用後界面IMC層的成長厚度外，也將對銲點的剪力強度進行測試。藉由IMC的厚度量測來探討IMC的成長機制、擴散係數以及生成時所需克服的致動能，而銲點經剪力推球測試的結果則可做為評估銲點強度的參考，並再由銲點破壞模式分析更進一步了解銲點的破壞機制，最後針對IMC、剪力強度和破壞模式三者間的關係做深入探討。
無鉛銲點的靜態與潛變實驗主要探討Sn-3.5Ag及Sn-4Ag-0.5Cu二種銲點的靜態行為及潛變特性。靜態實驗包括比較銲點在25℃、75℃、125℃、150℃四個溫度下的靜態強度，並探討可能的變形機制，最後將負載及位移再換算成應力與應變，且藉由曲線嵌合得到近似的數值模型以便做為將來評估銲點強度的基準。潛變實驗則藉由靜態實驗求得的靜態強度做為選取應力等級時的參考，也是在25℃、75℃、125℃、150℃四個溫度下進行。潛變實驗的目的在於探討無鉛銲點在高溫時的塑性變形行為，並由實驗求得的應力指數及致動能來輔助了解銲點的潛變機制。使用的潛變模型共包括Arrhenius Power law、Dorn方程式及雙曲線正弦應力函數。
1. 陳力俊, 謝宗雍, “微電子材料與製程”.
2. 江國寧, “電子構裝與計算力學”, 國立清華大學動機系.
3. Rao R. Tummala, “Fundamentals of Microsystems Packaging,” McGraw Hill, 2001.
4. TSMC Wafer Solder Bumping.
5. M. Abtew and G. Selvaduray, “Lead-free Solders in Microelectronics,” Materials Science and Engineering, Vol. 27, pp. 95-141, 2000.
6. PBGA data sheet, www.amkor.com.
7. Y. Sawada, K. Harada, H. Fujioka, ”Study of Package Warp Behavior for High-Performance Flip-Chip BGA,” Microelectronics Reliability, Vol. 43, pp. 465–471, 2003.
8. L. J. Turbini, G. C. Munie, D. Bernier, J. Gamalski and D. W. Bergman, ”Examining the Environmental Impact of Lead-Free Soldering Alternatives,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 1, January 2001
9. European Lead-free Technology Roadmap, http://www.tintechnology.com.
10. Z. S. Karim, “Fabrication and Reliability Studies of Lead-Free Solder Bumps,” Advanced Interconnect Technology Ltd..
11. C. Bastecki, “A Benchmark Process For the Lead-Free Assembly of Mixed Technology PCB’s,” September 1999.
12. R. Erich, R. J. Coyle, G. M. Wenger and A. Primavera, “Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment,” IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, 1999.
13. K. Y. Lee, M. Li, D. R. Olsen and W. T. Chen, “Microstructure, Joint Strength and Failure Mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag Solders in BGA Packages,” Electronic Components and Technology Conference, 2001.
14. C. H. Zhong, S. Yi and D. C. Whalley, “Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages,” Soldering and Surface Mount Technology, Vol 14, No. 2, pp. 40-50, 2002.
15. C. H. Zhong and S. Yi, “Solder Joint Reliability of Plastic Ball Grid Array Packages,” Soldering and Surface Mount Technology, Vol 11, No. 1, pp. 44-48, 1999.
16. Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnson, “Brittle Interfacial Fracture of PBGA Package Soldered on Electroless Nickel / Immersion Gold,” Electronic Components and Technology Conference, 1998.
17. M. Amagai, M. Watanabe, M. Omiya, Kikuo Kishimoto and T. Shibuya, “Mechanical Characterization of Sn-Ag-based Lead-free Solders,” Microelectronics Reliability, Vol. 42, pp. 951–966, 2002
18. K. Zeng and K. N. Tu, “Six Cases of Reliability Study of Pb-free Solder Joints in Electronic Packaging Technology,” Materials Science and Engineering R, Vol. 38, pp. 55-105, 2002.
19. C. E. Ho, L. C. Shiau and C. R. Kao, “Inhibiting the Formation of (Au1–xNix)Sn4 and Reducing the Consumption of Ni Metallization in Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 11, pp. 1264-1269, 2002.
20. C. M. Liu, C.E. Ho, W.T. Chen and C. R. Kao, “Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish,” Journal of Electronic Materials, Vol. 30, No. 9, pp.1152-1156, 2001.
21. T. Woodrow, “Lead Elimination From PWAs,” No-Lead Solder Early Customer Interface Meeting, 9 May 2001, Boeing Phantom Works.
22. K. Seeling and D. Suraski, “A COMPARISON OF TIN-SILVER-COPPER LEAD FREE SOLDERALLOYS,” AIM Incorporated.
23. C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, “Effect of Cu Concentration on the Reactions between Sn-Ag-Cu Solders and Ni,” Journal of Electronic Materials, Vol. 31, No. 6, pp. 584-590, 2002.
24. L. C. Shiau, C. E. Ho and C. R. Kao, “Reactions Between Sn–Ag–Cu Lead-free Solders and the Au/Ni Surface Finish in Advanced Electronic Packages,” Soldering and Surface Mount Technology, Vol. 14, No. 3, pp.25-29, 2002.
25. N. Duan, J. Scheer, J. Bielen, M. van Kleef, “The Influence of Sn–Cu–Ni(Au) and Sn–Au Intermetallic Compounds on the Solder Joint Reliability of Flip Chips on Low Temperature Co-fired Ceramic Substrates,” Microelectronics Reliability, Vol. 43, pp. 1317–1327, 2003.
26. Y. D. Jeon, A. Ostmann, H. Reichl and K. W. Paik, “Comparison of Interfacial Reactions and Reliabilities of Sn3.5Ag, Sn4Ag0.5Cu, and Sn0.7Cu Solder Bumps on Electroless Ni-P UBMs,” Electronic Components and Technology Conference, 2003.
27. B. Salam, N. N. Ekere and D. Rajkumar, “Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation,” Electronic Components and Technology Conference, 2001.
28. R. J. Coyle and P. P. Solan, “The Influence of Test Parameters and Package Design Features on Ball Shear Test Requirements,” IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, 2000.
29. I. Shohji, T. Yoshida, T. Takahashi and S. Hioki, “Tensile Properties of Sn–Ag Based Lead-free Solders and Strain Rate Sensitivity,” Materials Science and Engineering A, Vol. 366, pp. 50–55, 2004.
30. X. Q. Shi, W. Zhou, H. L. Pang and Z. P. Wang, “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy,” Journal of Electronic Packaging, , Vol.121, pp. 179-185, September 1999.
31. S. W. Chen, S. H. Lee and M. C. Yip, “Mechanical Properties and Intermetallic Compound Formation at the SnNi and Sn0.7wt.%CuNi Joints,” Journal of Electronic Materials, Vol. 32, No.11, pp. 1284-1289, 2003.
32. C. Kanchanomai, Y. Miyashita, Y. Mutoh and S. L. Mannan, “Influence of Frequency on Low Cycle Fatigue Behavior of Pb-free Solder 96.5Sn-3.5Ag,” Materials Science and Engineering A, Vol. 345, pp. 90-98, 2003.
33. X. Q. Shi, H. L. J. Pang, W. Zhou and Z. P. Wang, “Low cycle Fatigue Analysis of Temperature and Frequency Effects in Eutectic Solder Alloy,” International Journal of Fatigue, Vol. 22, pp. 217–228, 2000.
34. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine, “Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders,” Journal of Electronic Materials, Vol.26, No. 7, 1997
35. H. Yang, P. Deane, P. Magill and K. L. Murty, “Creep Deformation of 96.5Sn3.5Ag Solder Joint In A Flip Chip Package,” Electronic Components and Technology Conference, 1996.
36. D. K. Joo and J. Yu, “Effect of Microstructure on the Creep Properties of the Lead- free Sn-3.5Ag-Cu Solders,” Electronic Components and Technology Conference, 2002.
37. F. Guo, S. Choi, K. N. Subramanian, T. R. Bieler, J. P. Lucas, A. Achari and M. Paruchuri, “Evaluation of Creep Behavior of Near-eutectic Sn-Ag Solders Containing Small Amount of Alloy Additions,” Materials Science and Engineering A, Vol. 351, pp. 190-199, 2003.
38. H. G. Song, J. W. Morris Jr. and F. Hua, “Anomalous Creep in Sn-Rich Solder Joints,” Material Transaction, Vol. 43, No. 8, pp. 1847-1853, 2000.
39. S. Wiese, A. Schubert, H. Walter, R. Dudek, F. Feustel, E. Meusel, B. Michel, “Constitutive Behaviour of Lead-free Solders vs. Lead-containing Solders Experiments on Bulk Specimens and Flip-Chip Joints,” Electronic Components and Technology Conference, 2001.
40. A. Schubert, H. Walter, R. Dudek and B. Michel, “Thermo-Mechanical Properties and Creep Deformation of Lead-containing and Lead-free Solders,” International Symposium on Advanced Packaging Materials, 2001.
41. C. H. Raeder, G. D. Schmeelk, D. Mitlin, T. Barbieri, W. Yang, L. F. Felton, R.W. Messler, D. B. Knorr and D. Lee, “Isothermal Creep of Eutectic SnBi and SnAg Solder and Solder Joints,” IEEE/CPMT Int’l Electronics Manufacturing Technology Symposium, 1994.
42. J. H. L. Pang, B. S. Xiong. C. C. Neo, X. R. Zhang, T. H. Low, “Bulk Solder and Solder Joint Properties for Lead Free 95.5Sn-3.8Ag-0.7Cu Solder Alloy,” Electronic Components and Technology Conference, 2003.
43. R. Darveaux and K. Banerji, “Constitutive Relations for Tin-Based-Solder Joints,” Electronic Components and Technology Conference, 1992.
44. K. S. Kim, S. H. Huh, and K. Suganuma, “Effects of Cooling Speed on Microstructure and Tensile Properties of Sn–Ag–Cu Alloys,” Materials Science and Engineering A, Vol. 333, pp. 106–114, 2002.
45. 劉國雄, 林樹均, 李勝隆, 鄭晃忠, 葉均蔚, “工程材料科學,” 全華科技圖書股份有限公司, 1996.
46. P. L. Tu, Y. C. Chan and J. K. L. Lai, “Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, Vol. 20, NO. 1, February 1997.
47. C. B. Lee, J. W. Yoon, S. J. Suh, S. B. Jung, C. W. Yang, C. C. Shur and Y. E. Shin, “Intermetallic Compound Layer Formation Between Sn3.5Ag BGA Solder Ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate,” Journal of Materials Science : Materials in Electronics, Vol. 14, pp. 487-493, 2003.
48. S. B. Jung, Y. Minamino, T. Yamane and S. Saji, Journal of Materials Science Letter, Vol. 12, 1993.
49. 彭健雄,許哲榮合譯, Reed-Hill, “物理冶金原理”.
50. J. Lau, W. Dauksher, J. Smetana, R. Horsley, D. Shangguan and T. Castello, “HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages,” Presented at IPC SMEMA Council APEX® 2003, www.GoAPEX.org.
51. S. W. R. Lee and X. Huang, “Analysis on Solder Ball Shear Testing Conditions with a Simple Computational Model,” Soldering & Surface Mount Technology, Vol. 14, pp. 45–48, 2002.
52. K. Bowman, “Mechanical Behavior of Materials,” John Wiley, pp.248, 2004.
53. D. Grivas, K. L. Murty and J. W. Morris Jr., “Deformation of Pb-Sn Eutectic Alloy at Relatively High Strain Rates,” Acta Metallurgica, Vol. 27, pp.731-737, 1979.
54. X. Q. Shi, Z. P. Wang, Q. J. Yang and H. L. J. Pang, “Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy,” Journal of Engineering Materials and Technology, Vol. 125, pp. 81-88, January 2003.
55. JEDEC STANDARD-BGA BALL SHEAR-JESD22-B117.
56. 韋孟育, “材料實驗方法-金相分析技術”.
57. JEDEC STANDARD- High Temperature Storage Life-JESD22-A103-B.
58. C. E. Ho, R. Zheng, G. L. Luo, A. H. Lin and C. R. Kao, “Formation and Resettlement of (AuxNi1–x)Sn4 in Solder Joints of Ball-Grid-Array Packages with the Au/Ni Surface Finish,” Journal of Electronic Materials, Vol. 29, No. 10, pp. 1175-1181, 2000.
59. H. D. Blair, T. Y. Pang and J. M. Nicholson, “Intermetallic Compound Growth on Ni, Au/Ni, and Pd/Ni Substrates with Sn/Pb, Sn/Ag, and Sn Solders,” Electronic Components and Technology Conference, pp. 259-267, 1998.
60. R. J. Coyle, P. P. Solan, A. J. Serafino and S. A. Gahr, “The Influence of Romm Temperature Aging on Ball Shear Strength and Microstructure of Arear Array Solder Balls,” Electronic Components and Technology Conference, 2000.
61. K. M. Levis and A. Mawer, “Assembly and Solder Joint Reliability of Plastic Ball Grid Array with Lead-Free versus Lead-Tin Interconnect,” Electronic Components and Technology Conference, pp.1198-1204, 2000.
62. C. E. Pearson, “The Viscous Properties of Extruded Eutectic Alloys of Lead-Tin and Bismuth-Tin, In,” Journal of the Institute of Metals, Vol. 54, pp.111-124, 1934.
63. Gere and Timoshenko, “Mechanics of Materials,” Fourth Edition, PWS Publishing Company, 1997.
64. Q. Zhang, A. Dasgupta and P. Haswell, “Viscoplastic Constitutive Properties and Energy- Partitioning Model of Lead-free Sn3.9Ag0.6Cu Solder Alloy,” Electronic Components and Technology Conference, pp.1862-1868, 2003.
65. X. Shi, Q. Yang, Z. Wang, D. Xie and Z. Shi, “New Creep Constitutive Relationship and Modified Energy-Based Life Prediction Model for Eutectic Solder Alloys,” SIMTech Technical Report (PT/01/021/JT).
66. X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang and Q. J. Yang, “A New Creep Constitutive Model for Eutectic Solder Alloy,” Journal of Electronic Packaging, Vol. 124, pp. 85-90, June 2002.
67. Z. Guo, Y. H. Pao and H. Conrad, “Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints,” Journal of Electronic Packaging, Vol. 117, pp. 100-104, June 1995.
68. J. E. Breen and J. Weertman, “Creep of Polycrystalline Tin,” Journal of Metals, pp. 1230-1234, Nov. 1995.
69. P. Adeva, G. Caruana, O.A. Ruano and M. Torralba, “Microstructure and High Temperature Mechanical Properties of Tin,” Materials and Science Engineering A, Vol. 194, pp. 17-23, 1995.
70. S. Choi, J. G. Lee, F. Guo, T. R. Bieler, K. N. Subramanian and J. P. Lucas, “Creep Properties of Sn-Ag Solder Joints Containing Intermetallic Particles,” JOM, pp. 22-26, Jun. 2001.
71. J. Villaina, O. S. Bruellerb and T. Qasim, “Creep Behaviour of Lead Free and Lead Containing Solder Materials at High Homologous Temperatures with Regard to Small Solder Volumes,” Sensors and Actuators A, Vol. 99, pp. 194–197, 2002.
72. M. L. Huang, L. Wang and C. M. L. Wu, “Creep behavior of eutectic Sn–Ag Lead-free Solder Alloy,” Journal of Material Research, Vol. 17, No. 11, November 2002.
全文公開日期 本全文未授權公開 (校內網路)全文公開日期 本全文未授權公開 (校外網路)