台灣半導體代工產業數十年來，在全球都佔有一席之地，不論是晶圓代工或者是後段的測試封裝，在全球市占率接近5成。消費性電子產品追求輕薄短小的趨勢，加上5G 世代的啟動，為日後半導體市場趨勢發展提升了動能。現在，晶圓代工廠如台積電也做起封裝生意，封測業因此紛紛投入資金朝向先進封裝製程發展，開發新材料以及新製程，不斷地挑戰固有的製程能力，以期能持續鞏固自身在全球半導體供應鏈中之重要地位。
鑑於半導體封測代工產業越來越多新產品開發專案，本研究試圖提出適用之新產品開發流程管理方法。台灣電子業廣為運用C流程七大完整步驟，其非常適合應用在自有品牌之新產品開發上，但對純代工產業而言，缺乏了市場評估以及企業自身的優劣勢分析，為補其不足之處，本研究旨在利用C流程作法，輔以加入市場研究、企業SWOT分析以及開發風險分析與管理，協助企業領導人帶領團隊走向正確的新產品策略與規劃。個案公司印證此流程之應用，在新產品開發完成量產初期之際，每月為公司注入百萬營收。

Taiwan's semiconductor foundry industry plays a major role in the worldwide. Foundry, assembly packaging and testing has nearly 50% of the global market share. Consumer electronics products are pursuing form factor, and the launch of 5G generation will provide momentum for the future trend development of semiconductor market. Now, wafer foundries such as TSMC have also started the packaging business. It forces the packaging and testing to invest money towards to the advanced packaging, and develop new materials and processes, constantly challenging the inherent process capabilities, continue to consolidate its position in the semiconductor supply chain.
In view of the increasing number of new product development (NPD) projects in the packaging and testing industry, this study attempts to propose feasible NPD process management methods. Taiwan’s electronics industry widely uses C flow, which is very suitable for NPD under its own brand. However, for the foundry and packaging, it lacks market evaluation and analysis of the company’s own advantages and disadvantages. The study aims to use the C flow practice and supplement by market research, SWOT analysis, risk assessment and management, to help top managers lead the team to the correct strategy and planning in NPD. The case confirms the application of this NPD process and obtains millions of revenue per month in the pre-production stage.

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