隨著科技的需求與晶片的發展，半導體製程的開發與微小化已逼近物理極限，摩爾定律將不適用；而全球化的時代，半導體為了提升企業競爭力與獲利，透過傳統議價降低生產成本的方式逐漸失去絕對優勢。透過精實生產提昇企業創造力儼然成為世界潮流，將精實由生產延伸到解決方案，由創造自我價值擴展成為與客戶共創價值。
本個案透過逆向物流及精實管理手法，以去除不必要的浪費、降低不必要的前置時間等等精實管理原則，運用到回收出貨晶圓載具；透過價值溪流圖與渠道流程圖分析，有效優化資訊流時間並透過減少沒有創造價值的步驟以有效降低生產週期。在實施逆向物流的同時，更積極地精簡作業流程，創造與客戶雙贏的局面，並提昇客戶滿意度。

The development and microminiaturization of semiconductor processes are approaching physical limit, sooner or later Moore's Law will be no longer applicable. Following the trend of globalization, it is now difficult for enterprises to ensure sustainable growth and remain advantage at the same time through traditional cost reduction methods. Enhancing enterprise creativity through lean production has become the world's trend, not only in production but also in creating value to customers.
The focus of this study removes unnecessary waste, reduces non value-adding activity on recycling and reuses semiconductor wafer frame box flow through the application of reverse logistics and lean production. By value stream mapping and swim-lane flowcharts analysis, information flow time can be greatly optimized and production cycle can be reduced effectively by reducing steps without value-adding. While reverse logistics is being implemented, the process is streamlined actively, creating a win-win situation with the customer, moreover improve customer satisfaction.

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