硬脆材料近來在半導體及光電產業應用廣泛，但薄化的效率需要提升。超聲輔助加工在過去研究顯示出提升材料移除率、降低切削力的優異表現，適宜發展應用於薄化加工。本論文將超聲振動用於磨削加工，探討徑向超聲輔助磨削和傳統磨削在加工硬脆材料時其加工機制之差異，分析磨刃之運動軌跡，建立超聲振動磨削作用機制模型，得到振幅與未變形切屑面積及振幅與等效切屑厚度之關係，並且進行實驗應證模型。實驗以材料移除率、表面粗糙度、磨削力、比磨削能及工件的表面狀況作為判斷依據。最終根據磨削效能及磨削參數之關係，獲得應用於矽之超聲輔助磨削加工參數之選擇依據。

Hard and brittle materials has been widely utilized in industrial recently. The growing market of semiconductor and photoelectric industrial require well adapted manufacturing processes to improve the efficiency of thinning machining. Since Ultrasonic Assisted Machining has been proved having advantages of higher removal rates and lower grinding forces, which are profitable in thinning machining, we applied this technology in grinding. In this thesis, motions of the grit of different amplitude of radial ultrasonic vibration assisted grinding are analyzed and a model of ultrasonic vibration assisted grinding are built, which gives a relationship of amplitude and equivalent chip thickness. We proved the above hypothesis according to the test result, which material removal rate, surface roughness, grinding force, specific energy and surface formation are measured and compared to the traditional grinding. According to the test result, the basis of the application of Ultrasonic Assisted Grinding brittle materials has obtained.

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