本計畫的目標將設定在以微機電技術設計並製造新穎、具高性能的微陀螺儀，並結合CMOS積體電路製程完成整合型感測器晶片。設計的新穎之處在於使用面型加工微陀螺儀與積體電路作直接整合。整合微傳感器包括微致動、感測元件與IC將更具系統的多功能、可控性及精準性等優點。因此本研究將以整合系統的概念，製作微感測器並企圖與IC進行整合。

This work describes design, fabrication of micro-electro-mechanical systems (MEMS) gyroscope. It focuses on the CMOS-MEMS (Complementary-Metal-Oxide Semiconductor) thin film lateral accelerometer and vertical gyroscope design .Structure fabricated by the post CMOS-MEMS surface micromachining process. The mass displacement resulted from external acceleration is in the angstrom to nanometer range. Such small mass and displacement bring challenges to detect the extreme small signals, which are under 1 mV/G and only a fraction change for the sensing capacitance

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