熱塑性聚亞醯胺應用於無膠銅箔基板｜國立清華大學博碩士論文庫

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研究生：	陳鼎勳 Ting-Shun Chen
論文名稱：	熱塑性聚亞醯胺應用於無膠銅箔基板
指導教授：	李育德 Yu-Der Lee
口試委員:
學位類別：	碩士 Master
系所名稱：	工學院 - 化學工程學系 Department of Chemical Engineering
論文出版年：	2006
畢業學年度：	94
語文別：	中文
論文頁數：	72
中文關鍵詞：	熱塑性聚亞醯胺、無膠銅箔基板
外文關鍵詞：	thermoplastic polyimide, 2L-FCCL
相關次數：	點閱：3 下載：0
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將以Two-Step method合成不同組成之Thermoplastic Polyimide(TPI)配方，應用於熱壓合法製備2-Layer Flexible Copper Cladding Laminate(2L-FCCL)。選用4,4'-oxydiphthalic dianhydride(ODPA)二酸酐單體，和1,3-bis(3-aminophenoxyl)benzene(APBN)二胺單體進行共聚合，藉由單體結構中柔性之醚基鍵結、不對稱間位結構增加聚亞醯胺主鏈柔軟性；並導入2,6-diaminopyridine(DAP)和diaminopoly- siloxane(DAPS)於TPI主鏈結構中，固定DAP添加量為二胺組成中1/7莫耳，主要將探討不同重量百分組成之DAPS或不同分子量之DAPS對TPI配方的影響。

由H1-NMR鑑證DAPS確實參與反應，存在於TPI主鏈結構中，並能有效提升銅箔和聚亞醯胺間的剝離強度，由0.68±0.04kgf/cm至1.67±0.10kgf/cm；由於DAPS為低表面能柔軟長鏈結構單體，易浮移至空氣接觸面，故DAPS組成比例增加或分子量增加時，皆能提升Cu/PI之間
的接著程度。

所合成不同組成之TPI配方，其熱裂解溫度都大於550℃、玻璃轉移溫度為177~186℃、熱膨脹係數為53.1~89.9ppm/℃、彈性係數為204.0~242.8kgf/mm2、拉伸強度為8.4~11.7kgf/mm2。

謝誌----------------------------------------------   I
摘要----------------------------------------------  II
目錄---------------------------------------------- III
圖目錄-------------------------------------------- VII
表目錄--------------------------------------------   X

第一章 緒論----------------------------------------  1
1-1前言--------------------------------------------  1
1-2印刷電路板--------------------------------------  3

第二章 文獻回顧------------------------------------  5
2-1軟性印刷電路板----------------------------------  5
2-1-1軟板組成--------------------------------------  5
2-1-1-1絕緣基材------------------------------------  5
2-1-1-2金屬導電層---------------------------------- 10
2-1-1-3接著劑-------------------------------------- 10
2-1-2 無膠軟板------------------------------------- 11
2-2聚亞醯胺系接著劑-------------------------------- 14
2-2-1黏著機制-------------------------------------- 15
2-2-2化學改質-------------------------------------- 17
2-2-2-1含氮雜環官能基------------------------------ 18
2-2-2-2聚矽氧烷------------------------------------ 22
2-3材料性質分析------------------------------------ 28
2-3-1熱性質---------------------------------------- 28
2-3-2機械性質-------------------------------------- 29
2-3-3表面性質-------------------------------------- 30
2-3-4接著性質-------------------------------------- 31

第三章 研究動機------------------------------------ 32

第四章 實驗部份------------------------------------ 34
4-1 實驗藥品--------------------------------------- 34
4-2 實驗設備--------------------------------------- 35
4-2-1 合成裝置------------------------------------- 35
4-2-1 分析儀器------------------------------------- 36
4-3 實驗流程圖------------------------------------- 37
4-4 實驗步驟--------------------------------------- 38
4-4-1熱塑性聚亞醯胺合成---------------------------- 38
4-4-1-1單體和溶劑之純化---------------------------- 38
4-4-1-2 聚醯胺酸之合成和聚亞醯胺薄膜之製備--------- 40
4-4-2 熱壓合式雙層銅箔基板之製備------------------- 42
4-4-3 材料結構鑑定和性質分析測試------------------- 42

第五章 結果和討論---------------------------------- 45
5-1 材料結構鑑定----------------------------------- 45
5-1-1單體鑑定-------------------------------------- 46
5-1-2聚醯胺酸鑑定---------------------------------- 49
5-1-3材料組成分析---------------------------------- 51
5-2熱壓合式雙層銅箔基板測試分析-------------------- 53
5-2-1剝離強度-------------------------------------- 53
5-2-2斷裂模式-------------------------------------- 56
5-3-1 熱性質--------------------------------------- 57
5-3-1-1熱裂解溫度---------------------------------- 57
5-3-1-2玻璃轉移溫度-------------------------------- 58
5-3-1-3熱膨脹係數---------------------------------- 60
5-3-2機械性質-------------------------------------- 62
5-3-2-1彈性係數------------------------------------ 62
5-3-2-2拉伸強度------------------------------------ 63
5-3-3 表面性質------------------------------------- 64
5-3-3-1表面能-------------------------------------- 64
5-3-3-2表面組成------------------------------------ 66

第六章 結論---------------------------------------- 67

第七章 參考文獻------------------------------------ 70

                                

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