本文主要是設計、製作與測試「整合高分子模具及卡榫封裝之改良式SCREAM製程」。本研究嘗試改良美國 Cornell Univ. 開發的SCREAM製程，以便較精確的掌握元件幾何外形和機械特性。另外，除了完成微機電元件外，本文也同時利用改良式 SCREAM 製程，於矽基材製作模具，然後進一步利用高分子鑄模技術，完成高分子撓性卡榫保護蓋，最後透過簡易組裝完成微機電元件的保護。藉由高分子撓性卡榫保護蓋與材料性質，初步完成防止水分及灰塵顆粒入侵微機電元件。
本文已成功驗證改良式SCREAM製程之可行性，製作出兩種XY移動平台，包括：（1）靜電致動式；（2）熱致動式。以改良式SCREAM製程同時完成高分子撓性卡榫保護蓋模具，透過高分子鑄模技術，完成卡榫結構。將微機電元件與高分子撓性卡榫保護蓋組裝後，經初步測試驗證達成防止水分入侵元件功能。

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