研究生: |
吳嘉益 Jia-Yi Wu |
---|---|
論文名稱: |
高功率氮化鎵高電子遷移率場效電晶體在藍寶石及矽基板之研究 High power GaN-Based HEMTs on Sapphire and Silicon Substrates |
指導教授: |
徐碩鴻
Shuo-Hung Hsu |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
電機資訊學院 - 電子工程研究所 Institute of Electronics Engineering |
論文出版年: | 2008 |
畢業學年度: | 96 |
語文別: | 英文 |
論文頁數: | 70 |
中文關鍵詞: | 氮化鎵 、異質結構場效電晶體 |
外文關鍵詞: | GaN, HEMT, high electron mobility transistor |
相關次數: | 點閱:1 下載:0 |
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本論文主要研究氮化鎵異質結構場效電晶體在矽基板及藍寶石基板上對於高功率與微波方面的應用。這些具有400 □m閘極寬度的功率元件展現了300 mA/mm高的最大電流密度,以及80 mS/mm 的轉導係數。這些結果也指出元件在矽基板上亦可獲得較佳的特性,並且不同形狀的元件結構被採用來觀察不同的幾何形狀對崩潰耐壓及其他的非理性效應的影響,包含了閘極漏電流與低頻雜訊,而這些形狀則為指叉狀、矩形及圓形結構。如預期中的結果,這些封閉式結構的矩形和圓形電晶體在藍寶石基板中展現了高達650伏特的崩潰耐壓,這同樣也驗證了擁有較多根的指叉狀閘極會展現出較嚴重的缺陷影響,這些缺陷是來自於蝕刻平臺隔離時所伴隨產生的破壞。基於這個現象,封閉式結構的元件有效的避免了這些缺陷並提高了部分元件特性,從實驗的結果觀察到封閉式結構比指叉狀結構擁有較少的低頻雜訊和較好的崩潰耐壓。最後,元件的微波特性也是研究的目標之一,量測閘極長度為2 □m及寬度為2 mm元件,可求得達3.4 GHz的截止頻率及8.0 GHz的震盪最大頻率,倘若閘極長度縮小至可和業界元件相比的長度時,其結果和業界的成果可說是相近的。
[1] O. Ambacher, "Growth and applications of group III-nitrides," Journal of Physics D (Applied Physics), vol. 31, pp. 2653-2710, 1998.
[2] B. J. Baliga, “Power Semiconductors Devices,” Boston:PWS pp28-29,1996.
[3] B. Gelmont, K. Kim, and M. Shur,”Monte Carlo Simulation of Electron Transport in Gallium Nitride, ” J.Appl. Phys.,74(3),pp.1818-1821,1993.
[4] B.J. Baliga, “Semiconductors for high voltage vertical channel field effect transistors, ” J.Appl Phys , vol 53, pp 1759-1764, 1982
[5] J. P. Ibbetson, P. T. Fini, K. D. Ness, S. P. DenBars, J. S. Speck, and U. K.Mishra, "Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors," Appl. Phys. Lett., vol. 77, pp. 250-2, 2000.
[6] I. P. Smorchkova, C. R. Elsass, J. P. Ibbetson, R. Vetury, B. Heying, P. Fini, E. Haus, S. P. DenBaars, J. S. Speck, and U. K. Mishra, "Polarizationinduced charge and electron mobility in AlGaN/GaN heterostructures grown by plasma-assisted molecular-beam epitaxy," J. Appl Phys, vol. 86, pp. 4520-4526, 1999.
[7] G. Y. Zhao, H. Ishikawa, T. Egawa, T. Jimbo and M. Umeno “Electron mobility on AlGaN/GaN heterostructure interface, ” Physica E: Low-dimensional Systems and Nanostructures Volume 7, Issues 3-4, Pages 963-966, 2000.
[8] S. C. Binari, W. Kruppa, H. B. Dietrich, and G. Kelner, “Fabrication and characterization of GaN FETs,” Solid-State Electron., vol. 41, pp. 1549–1554, 1997.
[9] B. M. Green, K. K. Chu, E. M. Chumbes, J. A. Smart, and J. R. Shealy, “The effect of surface passivation on the microwave characteristicsof undoped AlGaN/GaN HEMTs, ” IEEE Electron Device Lett.,Volume: 21, Issue: 6 On page(s): 268-270, 2000.
[10] J. S. Lee, A. Vescan, A. Wieszt, R. Dietrich, and H. Leier, “Small signal and power measurements of AlGaN/GaN HEMT with SiNpassivation, ” IEEE Electronics Lett., Issue: 2 On page(s): 130-132, 2001.
[11] N. Zhang, “High voltage GaN HEMTs with low on-resistance for switching applications,” PHD thesis, UNIVERSITY of CALIFORNIA, Santa Barbara, 2002.
[12] W. R. Frensley, "Power-limiting breakdown effects in GaAs MESFET's," IEEE Trans. Electron Devices, vol. 28, pp. 962-970, 1981.
[13] T. M. Barton and P. H. Ladbrooke, "The role of the device surface in the high voltage behaviour of the GaAs MESFET," Solid-State Electronics, vol. 29, pp. 807-813, 1986.
[14] Y.-F. Wu, A. Saxler, M. Moore, R. P. Smith, S. Sheppard, P. M. Chavarkar, T. Wisleder, U. K. Mishra, and P. Parikh, "30-W/mm GaN HEMTs by Field Plate Optimization," IEEE Electron Device Lett., vol. 25, no. 3, pp. 117 -119, March. 2004.
[15] C. Y. Chan, T. C. Lee, S. S. Hsu, L. Chen, and Y. S. Lin, ”Impacts of Gate Recess and Passivation on AlGaN/GaN High Electron Mobility Transistors, ” Jpn. J. Appl.Phys. 46 (2007) 478.
[16] Y. C. Wang, ” Design and Fabrication of AlGaN/GaN Heterostructure Field Effect Transistors, ” Master thesis, National Chiao Tung University, Hsinchu, Taiwan, Republic of China.
[17] Y. H. Choi, J. Lim, I. H. Ji, K. H. Cho, Y. S. Kim, and M. K. Han,” AlGaN/GaN HEMT without Schottky contact on the dry-etched region for high breakdown voltage, ” Semiconductor Device Research Symposium, 2007.
[18] P. Parikh, Y. Wu, M. Moore, P. Chavarkar, U. Mishra, R. Neidhard, L. Kehias, and T. Jenkins, “High-linearity, robust, AlGaN-GaN HEMTs for LNA and receiver ICs,” in Proc. IEEE Lester Eastman Conf. High-Performance Devices, Aug. 2002, pp. 415–421.
[19] V. Kaper, V. Tilak, H. Kim, R. Thompson, and T. Prunty, J “High Power Monolithic AIGaN/GaN HEMT Oscillator,” Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest, 2002.
[20] H. Xu, C. Sanabria, A. Chini, S. Keller, and U.K. Mishra H. Xu, “A C-band high-dynamic range GaN HEMT low-noise amplifier,” Microwave and Wireless Components Letters, IEEE, 2004.
[21] S. C. Binari, W. Kruppa, H. B. Dietrich, G. Kelner, A. E. Wickenden, and J. A. Freitas, “Fabrication and characterization of GaN FETs,” Solid State Electron., vol. 41, no. 10, pp. 1549–1554, Oct. 1997.
[22] P. B. Klein, J. A. Freitas, S. C. Binari, and A. E. Wickenden, “Observation of deep traps responsible for current collapse in GaN metal–semiconductor field-effect transistors,” Appl. Phys. Lett., vol. 75, no. 25, pp. 4016–4018, Dec. 1999.
[23] G. Meneghesso, A. Chini, E. Zanoni, M. Manfredi, M. Pavesi, B. Boudart, and C. Gaquiere, “Diagnosis of trapping phenomena in GaN MESFETs,” in IEDM Tech. Dig., Dec. 2000, pp. 389–392.
[24] S. S. Islam, A. F. M. Anwar, and R. T. Webster, “A physics-based frequency dispersion model of GaN MESFETs,” IEEE Trans. Electron Devices, vol. 51, no. 6, pp. 846–853, Jun. 2004.
[25] T. Kunii, M. Totsuka, Y. Kamo, Y. Yamamoto, and H. Takeuchi, “A High Reliability GaN HEMT with SiN Passivation by Cat-CVD, ” 2004 IEEE Compound Semiconductor Integrated Circuit Symp., pp.197-200, Oct., 2004.
[26] E. D. Haberer, C. H. Chen, A. Abare, M. Hansen, and S. Denbaars, “Channeling as a mechanism for dry etch damage in GaN, “ Appl. Phys. Lett., 2000, 76, pp.3941-3943
[27] R. Dimitrov, V. Tilak, W. Yeo, B. Green, and H. Kim, “Influence of oxygen and methane plasma on the electrical properties of undoped AlGaN/GaN heterostructures for high power transistors, “ Solid-State Electron., 2000, 44, pp. 1361-1365
[28] C.Youtsey, I. Adesida, and G. Bulman, “Highly anisotropic photoenhanced wet etching of n-type GaN, ” Appl. Phys. Lett., 1997.
[29] M. T. Hung and Y. S. Ju, “Process dependence of the thermal conductivity of image reversal photoresist layers, ” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures --Volume 25, Issue 1, pp. 224-228 , January 2007
[30] K. K. Chu, M. J. Murphy, J. Bums, W. J. Schaff, and L. F. Eastman “High Speed High Power AlGaN/GaN Heterostructure Field Effect Transistors with Improved Ohmic Contacts, ” IEEE International Symposium on Compound Semiconductors, pp.427 – 430, Sep. 1997.
[31] R. Vetury, N. Q. Zhang, S. Keller, and U. K. Mishra, “The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs, ”IEEE Trans. Electron Devices 48 560 , 2001.
[32] S. C. Binari, P. B. Klein, and T. E. Kazior, “ Trapping effects in GaN and SiC microwave FETs ,“ Proc. IEEE 90 1048 , 2002.
[33] B. M. Green, K. K. Chu, E. M. Chumbes, J. A. Smart, and J. R. Shealy, “ The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs ,“ IEEE Electron Device Lett. 21 268 , 2000.
[34] Y. Cai, Y. Zhou, K. M. Lau, and K. J. Chen, ” Control of threshold voltage of AlGaN/GaN HEMTs by fluoride-based plasma treatment : From depletion mode to enhancement mode,” IEEE Trans. Electron Devices , 2006.
[35] Z. Q. Cheng, Y. Cai, J. Liu, Y. Zhou, K. Lau, “A Low Phase-Noise X-Band MMIC VCO Using High-Linearity and Low-Noise Composite-Channel Al0.3Ga0.7N/Al0.05Ga0.95N/GaN HEMTs,” - IEEE transactions on microwave theory and techniques, 2007.
[36] C. S. Chu, Y. Zhou, K. J. Chen, and K. M. Lau, “Q-factor characterization of RF GaN-based metal-semiconductor-metal planar interdigitated varactor,” IEEE Electron Device Lett. , 2005.