本研究中，建構出一套以紅光LED環型燈為光源，針對微小工件量測之顯微量測系統。系統以CCD攝影機為取像裝置，搭配立體顯微鏡，並以步進馬達搭配分釐卡，使移動平台作上下的垂直移動。
本研究中，利用對焦尋形法來求得待測物之三維輪廓資訊。由於光軸與移動平台並不垂直，必須經由位置補償修正其偏移的影像。Sum-Modified-Laplacian(SML)及Sum-Enhanced-Modified-
Laplacian(SEML)運算子可計算出待測物影像在對焦與失焦間的差異，進而得到待測物輪廓之深度變化資訊。在ML及EML運算後，加入高斯平滑濾波可消除影像中的雜訊。中值濾波可消除孤立點並保留影像邊緣輪廓。高斯擬合與內插則可消除雜訊並突顯待測物的高度。藉由自定指標與重建待測物輪廓去判定方法之優劣，以其最佳方法套用至錫球輪廓重建與高度量測上。

In this study, a novel 3D non-contact microscope system is developed. In this system, a CCD camera and microscope system are used to grab object images. A stepping motor is used to move the object vertically.
In this study, the technology of Shape-from-Focus is adopted to estimate the 3D geometry of examined object. The images have a status of the shift that is due to the optic axis and mobility platform are not vertical. We make use of position compensation to correct the shift of the images. Sum-Modified-Laplacian(SML) and Sum-Enhanced-Modified-
Laplacian(SEML) operator are generally used in this approach to identify object in focus. After an operation of ML and EML, we join Gaussian filter to remove noise in the images. Median filter can filter out the isolated points and preserve the edge contour of the images. Gaussian fitting and interpolation can eliminate noise and show the height of the objects. We rebuild the contour and define the index to optimize the method to reach a better result. At last, we adopt the best method to measure the height of the solderballs.

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