在現今之半導體製造業裡，對於元件的微小化，製造的尺寸也越來越小，因此製程的準確度要求越來越高，但是產品的多樣性和機台的漂移現象會影響製程的模型準確度和控制效果。
我們採用變異數分析和時間數列的結合，使模型能夠反應出機台擾動的影響，並且舉例在有偏移擾動出現與漂移擾動出現時，Dynamic ANOVA、JADE和Thread EWMA的控制效能，發現Dynamic ANOVA因為有動態項存在所以能及時反應出機台的變化，得到較佳的控制效能，而在少量產品部分也舉例比較當單一產品出現機率從0.01到0.3的控制結果，發現Dynamic ANOVA不管在少量產品或是大宗產品中，控制效能均表現穩定，所以Dynamic ANOVA這方法可以有效應付半導體工廠上常見的擾動，混合產品的生產也得到好的結果。

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