近年來物聯網的應用已成為超級熱門的話題之一。物聯網發展相當迅速，從穿戴式裝置的崛起，到智慧家庭與智慧製造的垂直領域深化，物聯網已經快速的滲透到各行各業當中。物聯網規模龐大且影響範圍甚廣，從物聯網發展基本的萬物聯網，至今已開始轉往大數據的管理分析。

欲瞭解物聯網產業的近年發展，本研究收集最新的市場資料，從中研討整體物聯網產業的發展趨勢與未來的技術走向。再從物聯網「端」與「網」的硬體需求與現今國際大廠的技術動向比較，以瞭解目前整體產業未來的發展性與重要挑戰。

本研究將探討從使用者端與伺服器端由物聯網需求帶出的市場機會，並對台灣廠商較少著墨的區塊，例如對微機電系統（Micro-Electro-Mechanical Systems，MEMS）、非揮發性記憶體（Nonvolatile memory，NVM）的需求影響進行較多的研究與探討，這些應用都將是晶片產業未來持續成長的重要應用市場，以提醒台灣業者不可輕忽並尋求下世代物聯網晶片發展可能的生態系統（ECO-System）。

In recent years, the application of internet of things (IoT) has become one of super popular topics in the world. The use of IoT development is quite rapid, from the rise of wearable devices, to smart home and to the deepening vertical field of smart manufacturing, IoT has rapidly penetrated into all walks of life. IoT also has large scale and a wide range of influence. From the basic of IoT which is things-to-things networking, the transformation has begun to big data management and analysis.
For the development of the Internet of Things industry in recent years, this study collects the latest market information to provide the overall development trend of the Internet of Things industry and future technology trends. And then from the "end" and "network" hardware needs of IoT and the technology trends of the current international manufacturers to understand the current overall industry development and important challenges.
This study will explore the market opportunities brought by the needs of the IoT from the user side and from the server side, particularly focus on the area where seldom involved by most of Taiwanese manufacturers, such as microelectromechanical systems (MEMS), nonvolatile memory (NVM) market to carry out more research and discussion. These applications will be an important market where is the future of the wafer industry continues to grow. Hope to remind Taiwan semiconductor industry that these opportunities and applications should not be ignored and seek the possibility to develop the next generation of semiconductor industry ecosystems (ECO-System) for Internet of Things.

中文部分
[1]. 曲威光，（2013），《積體電路與微機電產業》，新北：全華圖書股份有限公司
[2]. 拓墣產業研究所，（2016），《晶片發展趨勢與廠商課題》，台北：拓墣科技股份有限公司
[3]. 拓墣產業研究所，（2016），《物聯網帶動虛擬化轉型 大數據與人工智慧商機》，台北：拓墣科技股份有限公司
[4]. 紀昭吟，（2014，8月），〈What’s the Change：物聯網（IoT）驅動下的產業機會〉，發表於財團法人工業技術研究院產業經濟與趨勢研究中心IEK360講座，新竹
[5]. 黃嘉宏，（2016），《台灣 CMOS 微機電產業之發展機會》，國立交通大學，新竹
[6]. 彭茂榮，（2014），〈半導體大廠進入物聯網規格及平台競賽〉，工業技術研究院產業經濟與趨勢研究中心IEK產業情報網，取自http://ieknet.iek.org.tw/iekrpt/rpt_more.aspx?actiontype=rpt&indu_idno=1&domain=2&rpt_idno=345661527
[7]. Miller, Michael，（2015），《物聯網如何改變世界》，（胡為君，譯），台北：碁峰資訊股份有限公司
英文部分
[1]. Herrera-May, Agustín Leobardo & Soler-Balcazar, Juan Carlos & Vázquez-Leal, Héctor & Martínez-Castillo, Jaime & Vigueras-Zuñiga, Marco Osvaldo & Aguilera-Cortés, Luz Antonio, (2016), Recent Advances of MEMS Resonators for Lorentz, Force Based Magnetic Field Sensors: Design, Applications and Challenges, Basel, Switzerland : MDPI AG,
[2]. Ericsson, (2016), “Ericsson Mobility Report”, Telefonaktiebolaget LM Ericsson. Retrieved from https://www.ericsson.com/en/mobility-report
[3]. Girardin, Guillaume & Bonnabel, Antoine & Mounier, Eric (2014), “Technologies & Sensors for the Internet of Things, Businesses & Market Trends 2014-2024”, Yole Développement. Retrieved from http://www.yole.fr/iso_upload/Samples/Yole_IoT_June_2014_Sample.pdf
[4]. Lucero, Sam (2016), IoT platforms: enabling the Internet of Things, London, UK : IHS Technology
[5]. Macaulay, James & Buckalew, Lauren & Chung, Gina (2015), “Internet of Things in Logistics”, Troisdorf, Germany: DHL Customer Solutions & Innovation. Retrieved from http://www.dpdhl.com/content/dam/dpdhl/presse/pdf/2015/DHLTrendReport_Internet_of_things.pdf
[6]. Mckinsey Global Institute, (2015), The Internet of Things: Mapping the value beyond the hype, New York, USA: McKinsey & Company
[7]. Mounier, Eric & Troadec, Claire & Girardin Guillaume & Mouly, Jérôme (2016), “Status of the MEMS Industry, 2016 Report”, Yole Développement. Retrieved from https://www.slideshare.net/Yole_Developpement/status-of-the-mems-industry-2016-report-by-yole-developpement
[8]. Ortloff , Dirk & Schmidt, Thilo & Hahn, Kai & Bieniek, Tomasz & Janczyk, Grzegorz & Brück,Rainer (2014),MEMS Product Engineering: Handling the Diversity of an Emerging Technology Best Practices for Cooperative Development, Vienna, Austria : Springer-Verlag Wien
[9]. Vermesan, Ovidiu & Friess, Peter (2014), Internet of Things –From Research and Innovation to Market Deployment, Seattle, USA: River Publishers