可檢測正向力和剪力之透明軟性觸覺感測器系統

簡易檢索 / 詳目顯示

回結果列表

研究生：	王詠辰 Wang, Yung-Chen
論文名稱：	可檢測正向力和剪力之透明軟性觸覺感測器系統 Transparent and Flexible Tactile Sensor System for Normal and Shear Forces Detection
指導教授：	陳榮順 Chen, Rongshun 羅丞曜 Lo, Cheng-Yao
口試委員:	陳榮順羅丞曜陳宗麟
學位類別：	碩士 Master
系所名稱：	工學院 - 動力機械工程學系 Department of Power Mechanical Engineering
論文出版年：	2011
畢業學年度：	99
語文別：	中文
論文頁數：	90
中文關鍵詞：	觸覺感測器、觸控面板、軟性電子、剪力量測
相關次數：	點閱：2 下載：0
分享至:	分享至facebook 分享至twitter

查詢本校圖書館目錄查詢臺灣博碩士論文知識加值系統勘誤回報

本論文主要之目的在於設計及製作一新型電容式可檢測正向力及剪力之透明軟性觸覺感測器，此感測器將可使用在軟性顯示器觸控面板、機器人皮膚等相關應用。本研究所設計之元件，乃是利用單偏差電極對來取代四電極設計，不同於過去用到四個電極才能量測剪力的設計，單偏差電極對以改變電極形狀來放大電容之變化。在本研究中使用有限元素多重物理量耦合分析軟體COMSOL4 進行
機械場和靜電場的模擬，搜尋最佳化參數，以此參數實作元件。

在製程中分別以PET、PDMS 等具有撓性之材料作為基板和結構層，運用透明導電薄膜ITO 來製作電極，之後利用翻模和濺鍍等方式製作出各結構層，再使用UV 膠進行對準黏合。黏合後的元件以軟性連接器與控制和量測電路板連結，並建立一組完整的可攜式實驗平台。後續量測電路使用Analog 公司的數位電容轉換器、Microchip 公司的控制器和Linear Technology 公司的電源路徑管理器，並配合Matlab 模組進行DSP 濾波器設計，以此組合出完整的可攜式透明軟性觸覺感測器之實驗平台，並對元件之正向力、剪力、多點觸控、反應速度、透明度、柔軟度等進行測試和討論。

摘要    I
致謝    II
目錄    III
圖目錄    VII
表目錄    XIV
第一章 緒論    1
1    前言    1
2    研究背景與動機    2
3    文獻回顧    6
4    本文架構    13
第二章 觸覺感測器之電極設計與模擬分析    14
1    平行板電容值推導    14
2    觸覺感測器電極設計    16
3    施力的方向及大小與電容變化之關係    18
4    感測器電極進階設計    23
5    模擬結果    24
5.1    概念驗證    25
5.2    參數尋找    28
5.3    絕緣層厚度Tis和側壁層厚度Tsp比例模擬    29
5.4    絕緣層厚度Tis影響之模擬結果    31
5.5    側壁層厚度Tsp影響之模擬結果    33
5.6    側壁層Sh、Sw尺寸影響之模擬結果    35
5.7    進階電極設計之電容變化模擬    37
6    小結    39
第三章 製程說明與結果    40
1    元件製造流程    41
2    PDMS結構    43
2.1    ICP深蝕刻晶圓模仁和抗沾粘    44
2.2    光阻模仁    45
2.3    PDMS旋佈厚度    46
3    電極製作    48
3.1    蝕刻製程    50
3.2    金電極濺鍍製程    51
3.3    ITO電極濺鍍製程    52
3.4    多層電極濺鍍製程    53
3.5    穿透率測試    54
4    多層結構之對準    56
5    PDMS和PET接合    57
6    小結    59
第四章 量測電路與結果    61
1    數位電容轉換器    62
2    多工器與控制器    63
2.1    控制器與Matlab DSP    63
2.2    控制器與可攜式螢幕    67
3    正向力及剪力的量測設備與架設    71
4    量測結果    72
4.1    正向力量測    73
4.2    剪力量測    76
4.3    多點觸控    78
4.4    元件響應    79
4.5    可撓度測試    80
4.6    元件與螢幕整合    82
4.7    模擬與實驗比較    83
5    小結    85
第五章 結論與未來工作    86
1    結論    86
2    未來工作    87

                                

[1] R. Das and P. Harrop, "Printed, Organic & Flexible Electronics Forecasts, Players & Opportunities 2010-2020," IDTechEx Ltd., 2010.
[2] W. S. Wong and A. Salleo, "Flexible Electronics: Materials and Applications," Springer Science+Business Media LLC., 2009.
[3] W. Y. Chang, T. H. Fang, H. J. Lin, Y. T. Shen, and Y. C. Lin, "A Large Area Flexible Array Sensors Using Screen Printing Technology," Journal of Display Technology, vol. 5, pp. 178-183, 2009.
[4] H. J. Kwon and W. C. Choi, "Design and fabrication of a flexible three-axial tactile sensor array based on polyimide micromachining," Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, vol. 16, pp. 2029-2035, 2010.
[5] J. G. V. da Rocha, P. F. A. da Rocha, and S. Lanceros-Mendez, "Capacitive Sensor for Three-Axis Force Measurements and Its Readout Electronics," IEEE Transactions on Instrumentation and Measurement, vol. 58, pp. 2830-2836, 2009.
[6] H. K. Lee, S. I. Chang, and E. Yoon, "A Flexible Polymer Tactile Sensor: Fabrication and Modular Expandability for Large Area Deployment," Journal of Microelectromechanical Systems, vol. 15, pp. 1681-1686, 2006.
[7] H. K. Lee, J. Chung, S. I. Chang, and E. Yoon, "Normal and shear force measurement using a flexible polymer tactile sensor with embedded multiple capacitors," Journal of Microelectromechanical Systems, vol. 17, pp. 934-942, 2008.
[8] B. Lee, I. Hong, Y. Uhm, and S. Park, "The Multi-Touch System with High Applicability using Tri-axial Coordinate Infrared LEDs," IEEE Transactions on Consumer Electronics, vol. 55, pp. 2416-2424, 2009.
[9] M. Takasaki, Y. Fujii, H. Kotani, T. Mizuno, and T. Nara, "Proposal of Tele-touch Using Active Type SAW Tactile Display,"International Conference on Intelligent Robots and Systems, Beijing, China, pp. 1032-1037, 2006.
[10] H. Kotani, M. Takasaki, T. Mizuno, and T. Nara, "Integration of Tactile Information and Visual Information Using A Glass Substrate Surface Acoustic Wave Tactile Display,"International Joint Conference SICE-ICASE, Busan, South Korea, pp. 5411-5414, 2006.
[11] U. Paschen, M. Leineweber, J. Amelung, M. Schmidt, and G. Zimmer, "A novel tactile sensor system for heavy-load applications based on an integrated capacitive pressure sensor," Sensors and Actuators A: Physical, vol. 68, pp. 294-298, 1998.
[12] M. Y. Cheng, B. T. Liao, X. H. Huang, and Y. J. Yang, "A flexible tactile sensing array based on novel capacitance mechanism,"International Solid-State Sensors, Actuators and Microsystems Conference, Denver, Colorado, pp. 2182-2185, 2009.
[13] P. Peng, R. Rajamani, and A. G. Erdman, "Flexible Tactile Sensor for Tissue Elasticity Measurements," Journal of Microelectromechanical Systems, vol. 18, pp. 1226-1233, 2009.
[14] E. S. Hwang, J. H. Seo, and Y. J. Kim, "A polymer-based flexible tactile sensor for both normal and shear load detections and its application for robotics," Journal of Microelectromechanical Systems, vol. 16, pp. 556-563, 2007.
[15] Y. Hotta, Y. Zhang, and N. Miki, "Flexible distributed capacitive sensor with encapsulated ferroelectric liquid,"International Conference on Micro Electro Mechanical Systems, Cancun, Mexico, pp. 573-576, 2011.
[16] J. Yan and P. Tingrui, "An ultra-high sensitivity, capacitive pressure sensor using ionic liquid,"International Conference on Micro Electro Mechanical Systems, Cancun, Mexico, pp. 557-560, 2011.
[17] S. C. B. Mannsfeld, B. C. K. Tee, R. M. Stoltenberg, C. V. H. H. Chen, S. Barman, B. V. O. Muir, A. N. Sokolov, C. Reese, and Z. Bao, "Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers," Nat Mater, vol. 9, pp. 859-864, 2010.
[18] C.-S. Park, J. Park, and D.-W. Lee, "A piezoresistive tactile sensor based on carbon fibers and polymer substrates," Microelectronic Engineering, vol. 86, pp. 1250-1253, 2009.
[19] M. Bender, J. Trube, and J. Stollenwerk, "Characterization of a RF/dc-magnetron discharge for the sputter deposition of transparent and highly conductive ITO films," Applied Physics A: Materials Science & Processing, vol. 69, pp. 397-401, 1999.
[20] L. Tang and N. Y. Lee, "A facile route for irreversible bonding of plastic-PDMS hybrid microdevices at room temperature," Lab on a Chip, vol. 10, pp. 1274-1280, 2010.

全文公開日期本全文未授權公開 (校內網路)
全文公開日期本全文未授權公開 (校外網路)

簡易檢索 / 詳目顯示

相關論文