在微機電系統中，微掃瞄鏡常被應用於光纖開關、投影機和掃瞄式的顯微鏡等，而其整體效能，有一大部分取決於微掃瞄鏡性能的優劣。雖然微掃瞄鏡的性能可經由結構設計來達到，但由於製程上的誤差或是溫度、氣候等外界不確定性因素的影響下，導致其性能往往不如預期所設計，因此就必須由回授控制來確保或增進其性能。
本篇論文將感測器和致動器設計在同一結構上，其好處為利用現已成熟的微掃瞄鏡之製程，而不需要另外製作感測器，如此不但節省成本及晶片面積；且容易實現成為單一晶片系統。本論文中的感測器工作原理是藉著量測微掃瞄鏡下方兩電極板間的電容差，由電容差而知道微掃瞄鏡目前的角度，再經由控制器決定輸出到微掃瞄鏡的訊號。模擬及實驗結果証實所設計之控制器電路除了能使系統性能達到要求外，還能克服微掃瞄鏡的爆衝效應。

[1] H. Toshiyoshi and H. Fujita, “An Eelectrostatically Operated Torsion Mirror for Optical Switching Device,” in Proc. 8th Int. Conf. Solid-State Sensors and Actuators (Transducers’95), Stockholm, Sweden, pp. 25-29, June, 1995.
[2] P F. Van Kessel, L. J. Hornbeck, R. E. Meier and M. R. Douglass, “A MEMS-Based Projection Display, ” Proceedings of the IEEE, vol. 86 no. 8, August , 1998.
[3] D. L. Dickensheets, and G. S. Kino, “Silicon-Micromachined Scanning Confocal Optical Microscope,” IEEE Journal of Microelectromechanical Systems, vol. 7, no. 1, pp. 38-47, March, 1998.
[4] K. E. Petersen, “Silicon torsional scanning mirror,” IBM Journal of Research and Development., vol. 24, no. 5, pp. 631–637, 1980.
[5] J. Buhler, J. Funk, J. G. Korvink, F. P. Steiner, P. M. Sarro, and H. Baltes, “Electrostatic Aluminum Micromirrors Using Double-Pass Matellization,” IEEE Journal of Mciroelectromechanical System, vol. 6, no. 2, pp. 126-135, June, 1997.
[6] J. Hsieh and W. Fang, “A Novel Microelectrostatic Torsional Actuator”, Sensors and Actuators A, vol. 79, pp 64-70, 2000.
[7] H. Toshiyoshi and H. Fujita, “Electrostatic Micro Torsion Mirrors for an Optical Switch Matrix,” IEEE Journal of Microelectromechanical Systems, vol. 5, no 4, pp. 231-237, December, 1998.
[8] J. C. Chiou and Y. C. Lin, “A Novel Control Design of Stepping Micromirror Using Multiple Electrostatic Driving Electrodes”, IEEE-LEOS Optical MEMS, 2001.
[9] H. Toshiyoshi, W. Piyawattanametha, C. T. Chan, and M. C. Wu, “Linearization of Electrostatically Actuated Surface Micromachined 2-D Optical Scanner,” IEEE Journal of Microelectromechanical Systems, vol. 10, no. 2, pp. 205-213, June, 2001.
[10] C. J. Tay, C. Quan, S. H. Wang, and H. M. Shang, “Determination of a Micromirror Angular Rotation Using Laser Interferometric Method,” ELSEVIER Optics Communications, vol. 195, pp. 71-77, 2001.
[11] E. K. Chan, K. Garikipati, and R. W. Dutton, “Characterization of Contact Electromechanics Through Capacitance–Voltage Measurements and Simulations,” IEEE Journal of Microelectromechanical Systems, vol. 8, no. 2, pp. 208-216, June, 1999.
[12] J. C. Lotters, W. Olthuis, P. H. Veltink, and P. Bergveld, “A Sensitive Differential Capacitance to Voltage Converter for Sensor Application,” IEEE Transactions on Instrumentation and Measurement, vol. 48, no. 1, pp. 89-96, February, 1999.
[13] M. Madou, Fundamentals of microfabrication, 1nd ed. Florida: CRC, 1997, pp.466-467
[14] F. Pan, J. Kubby, E. Peeters, A. T. Tran and S. Muknerjee, “Squeeze Film Damping Effect on the Dynamic Response of a MEMS Torsion Mirror,” Journal of Micromechanics and Microengineering, vol. 8, pp. 200-208, 1998.
[15] F. P. Beer and E. R. Johnston, Mechanics of Materials, 2nd ed. Singapore: McGraw-Hill Book, 1992, Chapter 7.
[16] S. D. Seturia, Microsystem Design, 2 nd end. THE NETHERLANDS: Kluwer Academic Publishers, 2001, Chapter 19.
[17] A. J. Peyton, and V. Walsh, Analog Electronics with Op Amps, 1nd ed. New York: Cambridge University Press, 1993, Chapter 11.
[18] S. S. Rao, Mechanical Vibrations, 3nd ed. New York: Addison-Wesley, 1990, Chapter 3.
[19] X. M. Zhang, F. S. Chau, C. Quan, Y. L. Lam, and A. Q. Liua, “A Study of the Static Characteristics of a Torsional Micromirror,” Sensors and Actuators A, vol. 90, pp 73-81, 2001.