本文介紹一種整合濕式非等向性化學蝕刻和乾式的深活性離子蝕刻矽基材的製程(稱為DAWN製程)，以結合此二蝕刻方式的優點，從而衍生出兩種分別於適用於(100)矽晶片及SOI 晶片的平台製程。首先，利用DAWN製程於(100)矽晶片上安置蝕刻屏障，使得凸角結構和非{111}晶格面蝕刻底切的問題得以克服。在(100)矽晶片上，DAWN製程平台可以製造及整合以下結構：(1) 任意形狀的凸塊和孔洞，(2) 懸浮結構，(3) {111}晶格面所構成的V型槽和孔穴，(4) {111}晶格面和蝕刻屏障所構成的斜面結構，和(5) 多重高度結構。此外，在SOI晶片上，SOI DAWN製程平台還可製造及整合以下結構：(1) 薄膜彈簧、肋補強薄膜彈簧及厚彈簧，(2) 同平面/出平面致動器-直線或角度的運動，和(3) 厚質量塊、階梯狀質量塊及斜面質量塊，而整合的各式微結構可形成多自由度單晶矽移動平台，徹底突破傳統SOI晶片微加工技術的限制。最後，本文利用DAWN製程概念設計並製造生醫感測器，此三維微電極陣列具備穿刺細胞、內建電訊傳導和訊號前端放大等功能，且實際記錄到紐西蘭家兔的視網膜神經訊號。而未來希望與DAWN製程平台整合的奈米碳管薄膜，可藉由高分子薄膜變成奈米碳管-高分子複合薄膜，而奈米碳管薄膜和奈米碳管-高分子複合薄膜的機械性質也成功量測得到，並實際應用在微致動器上（有靜電驅動、熱驅動及光驅動等方式）。相信此一新開發的奈米碳管-高分子複合薄膜，未來有潛力成為重要的微機電元件材料。

This study has successfully demonstrated a DRIE assisted wet anisotropic bulk micromachining (DAWN process) to fabricate various three-dimensional MEMS devices on the (100) silicon wafer and SOI wafer. This platform employs the characteristics of the DRIE process to prevent the convex corner undercut and crystal plane dependent effect during bulk etching. Moreover, these mesas and cavities with arbitrary shape can further integrate with suspended thin film structures and the structure formed by the inclined {111} crystal planes. This study has also developed various out-of-plane springs and actuators on SOI wafer using the SOI DAWN process. Further, the integration of these out-of-plane components with the existing in-plane components is also demonstrated. Thus, various multi-degrees-of-freedom (DOF) movable platforms made of single-crystal-silicon (SCS) are implemented on a SOI wafer. A novel method has been developed for the manufacture of a three dimensional multi-electrode array. The microneedle array can be employed for not only bio-neural stimulating but also in-situ signal recording, and a test on rabbit retina was also available. This study has also demonstrated the idea of concreting the aligned CNT-films using the chemical vapor deposited (CVD) polymer film, so as to form the “CNT-polymer” composite-film. The mechanical properties of the aligned CNT-film and the “CNT-polymer” composite-film are characterized. Thus the “CNT-polymer” composite-film could be a potential material for MEMS.

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