隨著LED(Light Emitting Diode)在發光效率、亮度及壽命等特性的改良，LED的市場規模持續擴大。在LED的市場中，照明市場的重要性愈來愈高，因此高亮度LED的重要性也 愈來愈高。而若要達到高亮度的表現，唯有使用高功率型的LED封裝才能夠合乎要求，否則不但無法提昇發光效率，反而會因光線經不當的折射及反射而損耗殆盡，導致封裝體內部的溫度上昇。所以本論文，將採用田口式實驗計劃法(Taguchi Method)，針對LED四個主要結構特徵做分析，分析結構特徵包括封裝罩的幾何結構、反射杯傾斜角度、反射杯杯深以及反射杯杯面反射率，以解決多晶系高功率發光二極體於近距離混光效果不佳之缺點，最後將可得到一個適合於多晶系高功率發光二極體的封裝結構。

In these few years, the properties of LED (Light Emitting Diode) such as efficiency, brightness, and service life were improved dramatically. The scale of LED market continually increased. The illuminating gradually becomes an important application of LED. Hence, HB (High bright) LED becomes a very important research topic. To reach high bright and energy efficiency performance, the HP (High power) LED package must be used, the use of regular LED not only decrease the energy efficiency, but also increase the encapsulates temperature. The reason for that is due to the light comes from LED chip transform into heat by refraction and reflection. There are four key compositions of LED, which including the geometry of plastic lens, the angle of reflector cup, the depth of reflector cup, and the reflectance of reflector cup. Those factors determine the efficiency of the LED. Therefore, to find the better packing configuration, in this study, color mixing problem on multi-chip high power LED was optimized by Taguchi method. Finally, optimum package composition for multi-chip high power LED is presented.

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