環氧樹脂(Epoxy Resin)廣泛的應用於接著、封裝、塗佈等用途。然而環氧樹脂的施工形式皆是採用(雙液型)環氧樹脂與硬化劑依照環氧樹脂結構式中環氧基當量及硬化劑之適當比例，混和後才能硬化。環氧樹脂之應用性質包括硬化速度取決於環氧樹脂與硬化劑的反應性質，尤其是控制環氧樹脂與硬化劑的正確使用量往往是最沒有把握的關鍵步驟，特別是施工現場的設備以及人為因素，無法充分掌握，這是應用雙液型環氧樹脂時經常面臨的困擾。
本論文實驗利用自組裝相分離法，藉由環氧樹脂以及硬化劑(胺)劑量的不平衡，將硬化劑包覆於直徑約為8μm的微膠囊內，主要目的是藉由將硬化劑包覆成微膠囊的形式與導電高分子粉末或是金屬粉末混合到尚未反應的環氧樹脂中，藉由加熱的形式使微膠囊破裂，同時釋放出包覆於微膠囊內的硬化劑使環氧樹脂與硬化劑產生交聯反應而硬化。另外，藉由添加於環氧樹脂中導電高分子粉末或是金屬粉末，使環氧樹脂在固化的同時，能夠改變環氧樹脂絕緣的特性，使其具有導熱特性。
實驗結果顯示，若只運用化學結構為雙環氧基的環氧樹脂做加成反應，則製造出的微膠囊外殼成型較不完全，再加入化學結構為四環氧基的環氧樹脂後，則可以形成較完整的微膠囊殼層。在微膠囊加入環氧樹脂實驗中也證實適量胺的比例能夠較少殘留於微膠囊的表面，在製作成單液型環氧樹脂後，可以延長其保存的時間。
為了使環氧樹脂在固化後能夠有導熱性質，故在環氧樹脂中摻雜金屬粉末及導電高分子。在摻雜導電填充物後，環氧樹脂熱傳導係數明顯提升。而實驗數據也觀察到，若是摻雜相同重量的導電填充物，摻雜導電高分子的熱傳導係數則是較摻雜金屬粉末高。

Epoxy is widely used in packaging, coating and so on. However, both the form of epoxy resin construction is use of (two liquid type) epoxy resin and hardener in accordance with chemical structural epoxy equivalent and hardener appropriate proportion, after the construction of mixed hardening. Curing speed of epoxy depends on the properties of epoxy resin and curing agent in the reaction of nature, in particular epoxy and harder to control the correct usage is often the most critical steps are not sure, especially in equipment and construction site human factors can’t fully grasp, which is the problems that two liquid type epoxy resin often faced.
In this thesis, experiments using self-assembly phase separation, by epoxy resin and hardener (amine) doses of imbalance, the hardening agent is packaged in the micro-capsule that diameter about 8μm, then mixed the microcapsules and the conductive polymer powder or metal powder in the unreacted epoxy. When the epoxy is heated, the microcapsules will rupture, at the same time release the hardener (amine) inside the microcapsules, after that the epoxy and hardener will crosslinking. In addition, by adding the conducting polymer powder or metal powder that epoxy resin insulation properties will change to conductive.
The results showed that adding different chemical structure of epoxy can make microcapsules have more complete properties of package. An appropriate proportion of the curing agent can also reduce the residue on the microcapsule surface, so that a single liquid type epoxy resin can be stored longer.
In order to let epoxy resin have the properties of thermal conducting, metal powder (Al) conductive polymer were respectively added in to the epoxy resin. After the conducting material was added, the epoxy resin conducting capability was obviously promoted. On the other hand the experimental data is also clarify that if doped the same weight of conductive filler, doped conductive polymer has better thermal conductivity performance than the doped metal powder.

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