在半導體及微機電技術中，封裝為所有元件走出實驗室皆須經過的一種程序。封裝在微機電領域來說，其方法大多取自於傳統的IC封裝方式，但多變化的微機電元件常常讓傳統的IC封裝方法不敷使用，並且也提升了微機電元件的成本消耗。
本研究針對於本實驗室所發展之第三代微型陀螺儀，進行了本體結構製造，以及設計出可同時達成訊號導出以及氣密功能之覆晶型封裝結構，成功地完成其微型陀螺儀之封裝，並利用所設計的測試晶片平台，量測其訊號傳遞之覆晶焊錫凸塊阻抗約為1.8∼1.9Ω，其腔體約有2.4∼4.8×10-8 atm．cc/s之氦氣洩漏率。
結果顯示本研究所提出的封裝結構能應用於多接點微元件之訊號傳輸及氣密封裝上，也可有效降低封裝元件之整體面積。

In terms of the semiconductor and MEMS technology, package is the process that all the devices have to go through before being taking out of the laboratory. In the MEMS field, most of the ways of packaging are adopted from those of the traditional IC packaging, which, however, cannot satisfy the various needs of the modern MEMS devices and also increases the cost of the MEMS devices greatly.
This thesis is mainly about the fabrication of the third generation micro gyroscope that our laboratory have developed, the successful design of the structure of the flip chip type packaging, which is able to both transmit electric signal and function the hermetic sealing. With the structure, the packaging of the micro gyroscope has been successfully completed. Furthermore, by using the test vehicle chip, the electric resistance, ranging from 1.8 to 1.9Ω, has been measured from the flip chip solder bump which transmits electric signals. The helium leak rate of the hermetic sealing chamber is 2.4 to 4.8×10-8 atm．cc/s.
The result of the research shows that the innovative design of the structure of the flip chip type package demonstrated in the thesis can be applied in the signal transmission and the hermetic package of the multiple I.O. micro device. Moreover, the design can effectively minify the size of the packaging devices as well.

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