在積體電路製造業中，預燒測試(一種加速元件老化的測試) 在偵測初期故障方面扮演了一個相當重要的角色。在銷售給顧客之前，它保證了生產的積體電路的品質和可靠性，同時也可以預防有瑕疵的晶片進入下一階段的測試流程，藉此可以解省許多的測試成本。一般來說，測試者需要為預燒測試提供一個高溫和高壓的測試環境，同時晶片也會做功能性的測試，測試圖樣將不斷的送入晶片中，並由測試機台讀出由晶片所傳出的測試結果。在這個環境中，有瑕疵的產品將被提早的篩選出來，這對產品可靠性的提升有相當大的幫助。然而，對積體電路製造商來說，預燒測試期間的高測試費用(預燒爐加熱器的電力消耗是其中之一，因為要對晶片進行持續24小時到48小時的高溫測試)是一項非常巨大的成本消耗。本文提出一個降低晶片預燒測試能源的方法，根據內建一個溫度感測器在晶片當中來偵測晶片在預燒爐中被加熱時晶片真實的溫度，跑測試圖樣所產生的熱能(因為許多電晶體不斷開關的緣故)和由預燒爐加熱器所加給晶片的熱能都會被計算到。預燒爐中的晶片的溫度控制將更加準確而且加熱器的電力消耗也將比原本的預燒測試更加的經濟。模糊溫度控制方法被用來用控制預燒爐的溫度，根據計算由跑測試圖樣所產生的熱能和由預燒爐加熱器所產生的熱能。

In IC manufacturing, burn-in test (a kind of accelerated test) played an important part in early-life latent failures detecting. It ensures high quality and reliability of manufactured ICs before shipping them to customers. Typically, the tester needs to provide the high temperature and high voltage for burn-in test. However, the high test cost (the chamber heater power consumption) during burn-in test is a huge expense for IC manufacturer. This paper presents a methodology for burn-in test power reduction which based on the use of a built in temperature sensor for detecting the real chip temperature when chips on the burn-in board are heated in the burn-in room (i.e. chamber). Both the heat produced by applying test patterns and the heat given by the heater in the chamber are considered. The temperature control of the chip in the chamber is more accurately and the power consumption of the heater is more economical than the conventional burn-in process. The fuzzy temperature control method is used to control the chamber temperature by calculating the heat generated by applying test patterns and that given by the chamber heater.

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