摘要 (Abstract)
本研究採取液相法中的化學還原法，所利用的還原劑為葡萄糖，用來合成金屬銀銅複合粒子，而且最後合成粒子中的銅重量成分大於50﹪以上，希望降低銀的使用量，增加此等微粒的應用性。作為還原劑的葡萄糖不具毒性，且可製得奈米級微細粒子。反應液中除了母液之外，尚加入鹼劑氫氧化鈉及尿素調控環境的pH值。
反應過程中pH值會不斷上升，是由於從尿素分解而來，提供後續OH-的來源。相較於合成銀粒子而言，合成銀銅粒子時需要較長的時間以及較多量的PVP才能使粒子懸浮，而加入較多的PVP有助於提升最後銀銅粒子中的銅含量。另一方面，提高銅前驅鹽的含量也可以提高最後粒子中的銅含量。
合成出來的粒子經HRTEM分析，其晶格距離為0.217nm，介於0.23nm的銀與0.20nm的銅之間，推斷為合金結構；而從XPS檢測下200℃便能發現氧化銅的存在，表示在200℃時，外部的銅已被氧化，而內部仍保有金屬銅的特性。
經過清洗之後的粒子，發現丙酮相對於水的體積量為2.5倍時，能有效地降低粒子表面吸附的PVP數量，加入過多的丙酮則會將過多的PVP帶下來；改變溶液中的水含量，或是利用清洗多次的結果，也能降低粒子表面吸附的PVP量。最後洗淨出來的產品，其PVP相對於粒子的殘餘量，可從原先的96wt%降低至30wt%左右。

Anderson, T. S., R. H. Magruder III, J. E. Wittig, D. L. Kinser and R. A. Zuhr, “Fabrication of Cu-coated Ag Nanocrystals in Silica by Sequential Ion Implantation”, Nuclear Instruments and Methods in Physics Research, Vol. 171, No.3, 401-405（2000）
Antelman, M. S., “The Encyclopedia of Chemical Electrode Potentials”, Plenum Press, New York（1982）
Bonet, F., V. Delmas, S. Grugeon, R. H. Urbina, P. Y. Silvert and K. T. Elhsissen, “Synthesis of Monodisperse Au, Pt, Pd, Ru and Ir Nanoparticles in Ethylene Glycol”, Nanostructured Materials, Vol. 11, No.8, 1277-1284（1999）
Curtis, A. C., D. G. Duff, P. P. Edwards, D. A. Jefferson, B. F. G. Johnson, A. I. Kirkland and A. S. Wallace, “Preparation ans Strutural Characterization of an Unprotected Copper Sol”, The Journal of Physical Chemistry, Vol. 92, No.8, 2270-2275（1988）
Dai, H., H. Li and F. Wang, “ An Alternative Process for the Preparation of Cu-Coated Mica Composite Powder”, Surface and Coatings Technology, Vol. 201, No. 6, 2859-2866（2006）
Dhas, N. A., C. P. Raj and A. Gedanken, “Synthesis, Characterization, and Properties of Metallic Copper Nanoparticles”, Chemistry of Materials, Vol. 10, No 5, 1446-1452（1998）
Eastman, J. A., S. U. S. Choi, S. Li, W. Yu and L. J. Thompson,“Anomalously Increased Effective Thermal Conductivities of Ethylene Glycol-Based Nanofluids Containing Copper Nanoparticles”, Applied Physics Letters, Vol. 78, No.65, 718-720（2001）
Fan, N, L. Xu, J. Li, X. Ma and Y. Qian, “Selective Synthesis of Plate-Like and Shrub-Like Micro-Scale Copper Crystallites”, Journal of Crystal Growth, Vol. 299, No.1, 212-217（2007）
Goia, D. V. and E. Matijevic, “Preparation of Monodispersed Metal Particles”, New Journal of Chemistry, Vol. 22, No.11, 1203-1215（1998）
Guglielmo, G., Condorelli, L. L. Costanzo, I. L. Fragala, S. Giuffrida and G. Ventimiglia, “A Single Photochemical Route for the Formation of Both Copper Nanoparticles and Patterned Nanostructured Films”, Journal of Materials Chemistry, Vol. 13, No. 10, 2409－2411（2003）
Gwak, J. H., L. Chae, S. J. Kim and M. Lee, “Surface Plasmon Absorption Characteristics and Nonlinear Optical Properties of Silver/Copper Codoped Silica Thin Films”, Nanostructured Materials, Vol. 8, No. 8, 1149-1156（1998）
Hai, H.T., J.G. Ahn, D.J. Kim, J.R. Lee, H.S. Chung and C.O. Kim, “Developing Process for Coating Copper Particles With Silver by Electroless Plating Method”, Surface & Coatings Technology, Vol. 201, No.6, 3788–3792 (2006)
Huang, H. H., F. Q. Yan, Y. M. Kek, C. H. Chew, G. Q. Xu, W. Ji, P. S. Oh and S. H. Tang, “Synthesis, Characterization and Nonlinear Optical Properties of Copper Nanoparticles”, Langmuir, Vol. 13, No.2, 172-175（1997）
Jiang, H., K. S. Moon and C. P. Wong, “Synthesis of Ag-Cu Alloy Nanoparticles for Lead-Free Interconnect Materials”, IEEE 173-177（2005）
Kapoor, S., and T. Mukherjee, “Photochemical formation of Copper nanoparticles in poly (N-vinylpyrrolidone)”, Chemical Physics Letters, Vol. 370, No. 1-2, 83-87（2003）
Larson, H. W.,“The Effect Of Urea On Glucose Determination By The Formose Reaction”, The Journal of Biological Chemistry, Vol. 98, 151-156（1932）
Li, J., J. W. Mayer and E. G. Colgan, “Oxidation and Protection in Copper and Copper Alloy Thin Films”, Journal of Applied Physics, Vol. 70, No.5, 2820-2827（1991）
Link, S., Z. L. Wang and M. A. El-Sayed, “Alloy Formation of Gold-Silver Nanoparticles and the Dependence of the Plasmon Absorption on Their Composition”, The Journal of Physical Chemistry B, Vol. 103, No.18, 3529-3533（1999）
Lo, S. H.Y., Y.-Y. Wang and C. C. Wan, “Synthesis of PVP Stabilized Cu/Pd Nanoparticles With Citrate Complexing Agent and Its Application as an Activator for Electroless Copper Deposition”, Journal of Colloid and Interface Science, Vol. 310, No. 1, 190-195（2007）
Menzel, S., S. Strehle, H. Wendrock, K. Wetzig, “Effect of Ag-Alloying Addition on the Stress-Temperature Behavior of Electroplated Copper Thin Films”, Applied Surface Science, Vol. 252, No.1, 211-214（2005）
Mizubayashi, H., K. Goto, T. Ebisawa and H. Tanimoto, “Anelasticity Study on Electromigration Effect in Cu Thin Films”, Materials Science and Engineering A, Vol. 442, No.1-2, 342-346（2006）
Nakamura, T., Y. Tsukahara, T. Yamauchi, T. Sakata, H. Mori, and Y. Wada, “Preparation of Ag Core–Cu Shell Nanoparticles by Microwave-assisted Alcohol Reduction Process”, Chemistry Letters, Vol. 36, No.1, 154-155（2007）
Park, B. K., S. Jeong, D. Kim, J. Moon, S. Lim and J. S. Kim , “Synthesis and Size Control of Monodisperse Copper Nanoparticles by Polyol Method”, Journal of Colloid and Interface Science, Vol. 311, No.2, 417-424（2007）
Pauhi, D. and G. Dixit, “Effect of Electron Flow Direction on Model Parameters of Electromigration-Induced Failure of Copper Interconnects”, Journal of Applied Physics, Vol. 94, No10, 6463-6467（2003）
Ponce, A. A. and K. J. Klabunde, “Chemical and Catalytic Activity of Copper Nanoparticles Prepared via Metal Vapor Synthesis”, Journal of Molecular Catalysis A: Chemical, Vol .225, No.1, 1–6 (2005)
Qiu, S., J. Dong and G. Chen, “Preparation of Cu Nanoparticles from Water-in-oil Microemulsions”, Journal of Colloid and Interface Science, Vol. 216, No.2, 230-234（1999）
Smith, W. F. and J. Hashemi, “Foundations of Materials Science and Engineering”, 3rd ed. McGraw-Hill, New York（2004）
Sra, A. K. and R. E.Schaak, “Synthesis of Atomically Ordered AuCu and AuCu3 Nanocrystals from Bimetallic Nanoparticle Precursors”, Journal of the American Chemical Society, Vol. 126, No.21, 6667-6672（2004）
Suyal, G., “Bimetallic Colliods of Silver and Copper in thin Films: Sol-gel Synthesis and Characterization”, Thin Solid Films, Vol. 426, No.1-2, 53-61（2003）
Toshima, N. and T. Yonezawa, “Bimetallic Nanoparticles - Novel Materials for Chemical and Physical Applications”, New Journal of Chemistry, Vol. 22, No. 11, 1179-1201（1998）
Vairagar, A.V., S. G. Mhaisalkar, A. Krishnamoorthy, “Electromigration Behavior of Dual-Damascene Cu Interconnects-Structure, Width and Length Dependence”, Microelectronics Reliability, Vol. 44, No.5, 747-754（2004）
Wang, R. and B. Xie, “Study of Diffusion Ag in Cu Single Crystals”, Nuclear Instruments and Methods in Physics Research B, Vol. 198, No.3-4, 197-200（2002）
Wu, C., B. P. Mosher and T. Zeng, “One-Step Green Route to Narrowly Dispersed Copper Nanocrystals”, Journal of Nanoparticle Research, Vo1. 8, No.6, 965-969（2006）
Wu, S. H. and D. H. Chen, “Synthesis of High-Concentration Cu Nanoparticles in Aqueous CATB Solutions”, Journal of Colloid and Interface Science, Vol. 273, No.1, 165-169（2004）
Xie, S. Y., Z. J. Ma, C. F. Wang, S. C. Lin, Z. Y. Jiang, R. B. Huang and L. S. Zheng, “Preparation and Self-Assembly of Copper Nanoparticles via Discharge of Copper Rod Electrode in a Surfactant Solution: A Combination of Physical and Chemical Processes”, Journal of Solid State Chemistry, Vol. 177, No.10, 3743-3747（2004）
Xu, X., X. Luo, H. Zhuang, W. Li and B. Zhang, “Electroless Silver Coating on Fine Copper Powder and Its Effects on Oxidation Resistance”, Materials Letters, Vol. 57, No.24-25, 3987-3991（2003）
Zhang, Y. C., R. Xing and X. Y. Hu, “A Green Hydrothermal Route to Copper Nanocrystallites”, Journal of Crystal Growth, Vol. 273, No. 1-2, 280-284（2004）
Zhu, Y., K. Mimura, J. W. Lim, M. Isshiki, and Q. Jiang, ‘Brief Review of Oxidation Kinetics of Copper at 350 °C to 1050 °C”, Metallurgical And Materials Transactions A, Vol. 37, No.4, 1231-1237（2006）
伍安義，“以化學還原法合成奈米銀－銅粒子及其特性分析研究”，國立清華大學碩士論文（2006）
任鏘諭，“奈米金屬微粒之製備及其性質研究”，國立清華大學碩士論文（1999）
汪建民主編，“材料分析”，中國材料科學學會（1998）
李賢學，“化學還原法製備奈米銀及其應用”，國立清華大學博士論文（2005）
李賢學，周更生，“陶瓷被動元件”，科學發展，359期（2002）
吳文發，秦玉龍，“電遷移效應對銅導線的影響”， NDL奈米通訊，第六卷第一期（1999）
陳信宏，“奈米銀微粒之化學合成與應用研究”，國立清華大學碩士論文（2002）
張信貞，“數位噴墨簡介及其在建材的應用”，化工資訊與商情，No. 38, 46-57 （2006）
陳東煌，“複合奈米粒子”，化工資訊與商情月刊第3期（2003）
馬振基，“奈米材料科技原理與應用”，全華科技圖書股份有限公司（2004）
盧育杰，“葡萄糖還原系統下製備奈米銀及其反應動力學之研究”，國立清華大學碩士論文（2005）