由於薄膜顯示技術的大尺寸化，面板的尺寸已邁入比人還要高的階段。為了僅在部分面積上產生所需的電路，而將整片面板鍍上光罩，達到電路線的分佈，是相當浪費成本的。於是我們提出以雷射直寫的技術於玻璃基板上佈植銅線之可能機制及實驗結果。我們先添加適量的甘油於甲酸銅水溶液內，以抑制甲酸銅薄膜的結晶現象；然後在基板和甲酸銅水溶液之間，鍍上一層表面活性層，以改善玻璃基板的表面張力，使甲酸銅水溶液可均勻的塗佈在玻璃基板上，接著在75 0C下，放置15分鐘，讓水分蒸發，使甲酸銅成膜於基板上。我們利用事先撰寫好的LabVIEW程式，使電腦精確的控制移動平台速度，將Nd:YAG脈衝光束，聚焦並掃描於覆蓋有甲酸銅薄膜之玻璃基板上，甲酸銅薄膜因為吸收雷射光能量，使溫度上升到190 0C~210 0C之間，產生熱裂解反應而得直寫後之銅線沉積。利用波長1064 nm，脈衝寬度為7 ns，脈衝重複率為50 Hz，在掃描速度為0.25 mm/s，能量為1 mJ時，所熱解產生的金屬銅導線，均勻且平滑，附著力亦大大提升，線寬更窄至10.2 μm，已接近TFT-LCD的需求。所產生之銅線，厚度和金屬銅原子的純度有限，因此電阻值偏高，於是將寫入的電路再利用電鍍的方式，使銅膜增厚達到電導的提升。

In this research, we demonstrate the laser direct-write technique and report experimental results of depositing copper from the coated copper formate thin film on glass. In order to suppress the surface tension of water against the glass substrate, a surfactant layer was coated between the substrate and copper formate layer. Crystallization of the copper formate has also been eliminated by adding proper amount of glycerol into the water solution. To perform the laser direct-write process, Nd:YAG laser pulses (1064 nm) were focused and scanned on the glass substrates covered by copper formate film. Copper lines were deposited after the copper formate decomposed thermally. With scan speed at 0.25 mm/s and laser pulse energy at 1 mJ, the deposited 10.2- μm copper line showed good adhesion, good uniformity, and low edge roughness.
The direct-written linewidth is suitable for TFT-LCD application. However the thickness of the deposited copper line is too thin to provide sufficient conductivity. Therefore, we use the electroplating technique to increase the conductivity and the result seems to be satisfactory.

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