本文之研究目的是解決滾筒式奈米壓印的模具沾黏問題，考慮到大型滾筒模具的直接加工可行性，本研究運用大氣電漿化學氣相沈積法（APPCVD），於奈米壓印模具表面製作抗沾黏層。相較於氣相自組裝單分子層法，利用大氣電漿可以在多種的材料表面製作抗沾黏層，而且製程快速，不需要真空設備。
利用奈米壓印與滾筒式壓印之模具採用的材料：矽、鎳、鎳-磷來作為表面沾黏特性的研究對象。實驗發現試片在經過電漿處理後表面能皆會降低，表面粗糙度則會上升，其中後者是不利因素。因此透過實驗歸納出最佳化的製程參數，使表面水滴接觸角高達121o，表面能低於13.44 mN/m，表面粗糙度低於1.1 nm。抗沾黏層透過化學分析電子儀分析表面化學成分，顯示出含有造成低表面能的CFx。經過抗沾黏處理的試片，再分別利用原子力顯微鏡進行力量曲線量測，以及微拉伸試驗機進行與光阻的黏滯力量測。結果原子力顯微鏡探針與試片之間的黏滯力低於14.64 nN，與利用黏滯理論帶入量測得到的表面能計算之黏滯力趨勢吻合。
本研究之結果可以降低壓印模具的黏滯力，經過抗沾黏處理的模具在壓印之後利用電子掃描顯微鏡觀察發現沾黏情形已經改善。

In this study we use the Atmosphere Pressure Plasma Jet（APPJ） system to form an anti-adhesion coating on the imprinting mold, which could be flat or roller typed. It is fast, vacuum free and low temperature comparing to Self-assembled Monolayer by vapor phase deposition.
Samples of Si wafer, Ni film (by e-gun vapor deposition) and Ni-P film (by electroless plating) were prepared. These materials were desirable for the robust mold of imprinting. After the treatment on the samples, the surface energy was decreased and, however, roughness raised. Using an optimized process parameter, the water contact angle was 121o, surface lower than 13mN/m and roughness lower than 1.1 nm. Also, an ESCA was applied to analyse the chemical compose of the coating, the CFx species causing a low surface energy were founded of which. Finally the adhesion force was measured by the AFM force curve and it was lower than 14.64 nN after treatment. Then the adhesion results were compared to the prediction by adhesion theory.
We have used the APPJ system to form an anti-adhesive coating on Si, Ni and Ni-P in just few minutes. The Si, Ni and Ni-P had achieved the nearly same contact angles about 120o and low adhesion force after the treatment. A thin, uniform and roughness controlled anti-adhesion coating with low surface energy was being coated on the structured mold with nano-scale patterns, thus the sticking was avoided.

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