半導體製造業所投入的設備成本昂貴，使得產能充分的利用為晶圓廠面臨需求所決策之問題。並且晶圓代工是以顧客導向為主，因此客戶需求滿足（Demand Fulfillment）為其企業之經營目標。因為半導體製程相當複雜，產品必須先經過光罩製作、試產及驗證等流程後才可進行量產，並且機台種類的不同使得光罩圖型將根據其所需要的機台才可進行製造而產生光罩配置之問題。
由於新產品的需求具有不確定性，對公司產能運用造成困難，而在新產品投片分配的過程中，將決定新產品投入的晶圓廠，並且必須考慮前置時間後才可進行生產，因此本研究將探討新產品投片對需求滿足之影響。
本研究考慮半導體製造業需求與限制，進行新產品與現有產品投片的分配，並以成本最小化為目標建立需求滿足模型，以提升半導體製造業廠商的競爭力。最終以半導體製造業為實證對象，進行分析案例公司與模型分配結果，並提出兩者間差異處。

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