本實驗以不同大小、不同體積分率之原生鑽石(Saw Diamond)製作鑽石銀基複材；以濕式球磨法將鑽石與銀兩種粉末進行混合分散，接著採用大氣熱壓法，在600 ℃、500 MPa或1000 MPa壓力下熱壓30分鐘後製成試片，量測其熱傳導、熱膨脹、硬度等性質，並觀察其熱性質變化趨勢，評估此複合材料在電子構裝散熱材的應用潛力。
Diamond/Ag 複材截面於SEM下可看到鑽石均勻分佈之圖像，鑽石本身無碎裂或剝離之情形出現。而在銀添加30 vol%之100 ~ 120 μm鑽石之複材中，可得到熱傳導係數為475 W/m•K，明顯比純銀(410 W/m•K)高出許多。
熱傳導性質方面，在20 vol%複材中，可發現隨著鑽石顆粒尺寸變大，總表面積減少，熱傳導係數上升。而鑽石含量增加，複材熱傳導係數下降，推測與緻密度較差有關。熱膨脹係數方面，隨著鑽石體積分率上升，熱膨脹係數並無明顯下降的趨勢，應與界面無擴散鍵結(Diffusion Bonding)且原生鑽石較碎裂鑽石表面平滑無機械鍵結(Mechanical Interlocking)有關。硬度方面，則隨著鑽石體積分率上升，鑽石提供散佈強化的作用而上升。
整體而言，以此法製造鑽石銀基複合材，製程設備便宜，硬度跟熱傳導係數都能隨著鑽石添加而改善性質。

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