軟性電子產品為未來消費性電子科技產品亟需發展之方向，而其可撓曲特性乃關係產品開發成敗重要指標之ㄧ。
超薄型晶片軟膜接合(ultra-thin chip-on-flex，UTCOF)異方性導電膠(anisotropic conductive adhesive，ACA)覆晶構裝乃一可應用於超細間距之構裝形態。唯此一嶄新技術，在製程中仍有許多重要問題，如熱壓合製程後之ACA接點電阻值導電機制等，尚待吾人深入探討。
本論文主要利用ANSYS®有限單元分析套裝軟體建立一三維有限單元分析模型，配合接觸力學分析，對UTCOF異方性導電膠覆晶構裝熱壓合製程後之ACA接點電阻值導電機制進行模擬分析。分析對象包括晶片、ACA接點、ACA和軟膜等。本論文首先針對ACA接點中凸塊和單顆導電顆粒與墊片和單顆導電顆粒之導電機制進行熱壓合固化分析，並探討三種不同ACA接點結構之影響。其次，利用失效/再生單元網格(death/birth element)生成技術分析在溫度效應下膠材對ACA接點導電機制之影響。此三維有限單元分析結果最後並與以接點電阻量測儀(resistance meter)和掃瞄式電子顯微鏡(scanning electron microscope，SEM)量測之電阻值相互驗證。
本論文獲得之成果，不但有助於對UTCOF異方性導電膠覆晶構裝熱壓合製程後之ACA接點導電機制之暸解，藉由參數化分析，並可供構裝產業研究人員進行UTCOF異方性導電膠覆晶構裝設計之參考。

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