台灣為全球注目的半導體及電子科技王國，傳統半導體製程技術之優點為可量產及具有高解析度，但常需昂貴的設備、材料與複雜的程序。此外，傳統半導體電子線路需藉由光罩以定義其輪廓，再透過蝕刻方式製造，因需使用高酸性的化學物質，會造成環保的問題。因此較低成本、簡單及環保的電子產品技術乃為未來發展的目標。
可連續量產、低耗能與生產快速的卷軸式凹版轉印(Roll-to-roll gravure offset printing)技術為其中的重要選項之一，所印製之細微導線厚度較小且寬度亦較窄，可應用於軟硬底材。由於卷軸式凹版轉印之轉墨(Off process)與定墨(Set process)製程需透過轉印布(Blanket)作為銀漿(Silver paste)傳遞之媒介，轉印布為軟性矽膠材質，對於轉墨製程之轉印版與定墨製程之基板的適用性較廣，但銀漿於轉印時易有損耗的情況產生，因此如何提升卷軸式凹版轉印之良率需特予關注。
為了有效提升卷軸式凹版轉印製程之銀漿轉印比例(Transfer ratio)，本論文乃以工研院電光所提供之原始銀漿，透過原始銀漿外加溶劑(Solvent)比例之方式，以實驗量測探討轉印製程的物理機制與相關影響印刷之參數，包括藉由接觸角量測儀(Contact angle meter)量測不同溶劑比例銀漿之表面張力，銀漿於轉印版、轉印布與基板常溫及升溫下之接觸角等。
接著，使用微拉力萬用測試儀(Universal micro-testing machine)探討於不同拉伸速率下銀漿於轉墨及定墨製程常溫與升溫時之轉印比例，並分析轉墨及定墨製程參數對於轉印比例的影響，透過更換底材的方式，如各轉印版、轉印布以及基板之選用與搭配，希能藉此找出影響卷軸式凹版轉印製程的重要印刷參數。最後，本論文亦以Surface Evolver軟體探討銀漿於轉墨及定墨製程之轉印比例，並與實驗結果相互驗證。
本論文之研究成果將可供相關研究人員於調整卷軸式凹版轉印製程參數之參考。

Taiwan as a kingdom of semiconductor and electronics technology has attracted the Global attention. The advantages of traditional semiconductor manufacturing process are mass production and high resolution. However, it generally needs expensive equipment and materials and complex procedures. Besides, the electronics circuities of traditional semiconductor were made through the photomask and etching processes. These two processes generally need to use highly acidic chemicals. Thus, it would cause the environmental concerns. Therefore, low-cost, simple, and eco-friendly electronics manufacturing technology would be the target in future development.
The roll-to-roll gravure offset printing technology is one of the important choices due to its exceptional advantages, such as continuous mass production, low energy consumption, and fast production. The technology can yield a much lower line height and thinner line width of fine line circuity. Thus, the fine line circuity made from the manufacturing technology can be used as a soft or hard substrate. Because the off and set processes in the roll-to-roll gravure offset printing technology needs the blanket to be a transfer media between the silver paste. The blanket is made of the soft silicon rubber; therefore, it was widely applied for the gravure in the off process, and for the substrate in the set processes. Nevertheless, the silver paste is apt to lose during the transfer process. Thus, it is very essential to pay an attention to improve the yield of roll-to-roll gravure offset printing technology.
The thesis aims at applying the experimental measurement to investigating the physical mechanism of the printing process by utilizing the silver paste provided from the Opto-Electronics & Systems Laboratories of ITRI, and several parameters, such as surface tension force of silver paste at different solvent content, contact angle of silver paste deposited on different gravure plates, blankets, and substrates.
Then, the universal micro-testing machine was used to explore the transfer ratio during the off and set processes. Their influences of loading rate and temperature were also investigated. In addition, to attain the important parameters on the roll-to-roll gravure offset printing process, some parameters, such as different types of gravure, blanket and substrates, on the off and set processes were further examined. Finally, the Surface Evolver code was also applied to evaluate the transfer ratio during the off and set processes, and the results are compared to those of the experiment.
The results in thesis can provide a reference for relevant researchers on adjusting the parameters of roll-to-roll gravure offset printing process.

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