研究生: |
鄭嘉葳 Cha-Wei Zheng |
---|---|
論文名稱: |
樹脂燒結固定磨粒鑽石線鋸切割矽晶棒之特性研究 A Study on Sawing Characteristics of Silicon Wafer Slicing with Resin-Bonded Diamond Wire Saw |
指導教授: |
左培倫
Pei-Lum Tso |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2005 |
畢業學年度: | 94 |
語文別: | 中文 |
論文頁數: | 86 |
中文關鍵詞: | 晶圓鋸切技術 、樹脂燒結固定磨粒鑽石線鋸 、搖擺動作 、鑽石鋸線壽命 |
外文關鍵詞: | Wafer slicing technology, Resin-bonded diamond wire saw, Rocking motion, Diamond retention |
相關次數: | 點閱:2 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本文以樹脂燒結固定磨粒鑽石線鋸來進行矽晶棒的切割實驗,研究加工參數及矽試片材料移除率、表面粗糙度、鋸線壽命間的相互關係。對於樹脂線鋸加入不同的披覆物,期望改善鋸線的磨耗及壽命。並且探討鋸線搖擺動作在矽晶棒鋸切時所扮演的重要腳色。結果顯示,樹脂接合劑中加入銅披覆物可以提升73%~192%的鑽石鋸線壽命,而加入鎳披覆物可以提升34%~65%的鑽石鋸線壽命。而搖擺動作的加入提升被加工件最高達60%的材料移除率。
At present, ceramic materials are extensively used in substrate materials of semiconductor, mechanical and photoelectric devices. Not only brittle materials are very difficult to machining in mechanical way, but also the requirement increase with time rapidly. Free Abrasive machining for brittle materials had been used in the past, however its efficiency was too low and lots of slurry was wasting in machining process. In order to gain high accuracy and fine surfaces quality in industrial requirement more efficiently, we uses Resin-bonded diamond wire saw in Silicon wafer slicing. Effects of processing parameters on the performance of resin-bonded diamond wire sawing process, including material remove rate, machined surface roughness of the wafer, and life of the wire saw, are investigated in this paper., we expect to elongate wire life and improve diamond retention of the wire by using different fillers of resin-bonded diamond wire composites. Analyzing the importance of rocking-motion in silicon wafer slicing process in addition. The results showed that diamond wire life was 73% ~192% elongated with Copper fillers, and 34%~65% elongated with Nitride fillers added to the diamond composite. Slicing Silicon wafer with rocking-motion displays 60% material remove rate improving in maximum.
[1] K.Okamauara et.al,”Study on the Cutting Mechanism of Abrasive Grain(4Th.Report)”,Bill.jap.SocPrec.Eng., Vol.33, No.3pp161.
[2] John A. PATTEN,”Ductile regime machining of silicon nitride”, Advances in Abrasive Technology Ⅲ, 87-94.
[3] H. Ogawa, H. Suwabe, ”Study on Machining Characteristics of Wire Tool with Electrodeposited Diamond Grains”, JSPE,vol.60 No.3 Sep (1994) 329-334.
[4] M. Kojima, ”Development of new wafer slicing equipment”, Sumitomo Met., vol.42 No.4 (1990) 218-224.
[5] Toshiyuki Enomoto et. al, “Development of a Resinoid Diamond Wire Containing Metal Power for Slicing a Slicing Ingot”, Annls of the CIRP, vol.48 No.1 (1999) 273-276.
[6] S.Y. Luo, “Effect of fillers of resin-bonded composites on diamond retention and wear behavior”, Wear 236 (1999) 339-349.
[7] W.I. Clark et. al, “Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force”, International Journal of Machine Tools & Manufacture 43 (2003) 523–532.
[8] W.I. Clark et. al, “Fixed abrasive diamond wire machining—part II: experiment design and results”, International Journal of Machine Tools & Manufacture 43 (2003) 533–542.
[9] H.K. Tönshoff, H. Hillmann-Apmann,” Diamond tools for wire sawing metal components” Diamond and Related Materials 11 (2002) 742–748.
[10] C.M.Sung, ”Brazed diamond grid:a revolutionary design for diamond saws”, Diamond and Related Materials 8 (1999) 1540-1543.
[11] 甘炎益,「精密線鋸切割之研究」,國立清華大學動力機械工程學系碩士班論文,july 2001。
[12] 鄧嘉豪,「鑽石線鋸切割硬脆材料暨加工參數之研究」,國立清華大學動力機械工程學系碩士班論文,july 2002。
[13] 陳建民,「鑽石線鋸切割碳化矽與氧化鋁陶瓷材料之特性研究」,國立清華大學動力機械工程學系碩士班論文,july 2003。
[14] 顏柏輝,「微細鑽石線鋸鋸切特性與磨耗之研究」,國立清華大學動力機械工程學系碩士班論文,july 2004。
[15] M. Nakai et. al, “Development of a Fixed Diamond Wire Saw for Electronics Application”, Osaka Diamond Co.,Ltd Japan, (2001) 233-240.
[16] K. Ishikawa, H. Suwabe, “Development of Spiral Chip-Pocket Wire Tool Electrodeposited Diamond Grains”, Journal of the Japan Society Engineering, vol.62 No.2 (1996) 242.
[17] Y. Chiba, Y. Tani, “Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools”, Annals of the CIRP, vol52 No.1 (2003) 281-284.
[18] H.B. McLaughlin, “Precision cutting with a Diamond Wire Saw”, Cuting Tool Engineering June (1985) 17-19.
[19] P. G. Partridge et. al, “Microstructure and interfaces in diamond coated steel wires”, Journal of Materials Science 32 (1997) 4201-4208.
[20] M.B. Smith et. al, ”Multi-Wire FAST slicing for Photovoltaic Applications”, IEEE (1991) 979-981.
[21] TaKaya Watanabe et.al, “Study of Quartz Crystal Slicing Technology By Using Unidirectional Multi-Wire-Saw”, IEEE (2001) 329-337.
[22] K. Ishikawa, H. Suwabe, ”A Basic Study on Vibration Muti-Wire Sawing using Wire Fixed Diamond Grain”, JSPE, vol21 No.3 Sep (1987) 214-216.
[23] M.Undea, ”A Basic Study on Processing Characteristics of Diamond Multi-Wire Saw by means of the Workpiece Rotation Type”, JSPE, vol44 No.1 Jan (1995) 229-232.
[24] F. Schmid, M. B. Smith and C. P. Khattak, ”Kerf reduction using sharp wire”, IEEE (1993) 205-208.
[25] L. Yin, S. Jahanmir, “Abrasive machining of porcelain and zirconia with a dental handpiece”, Wear 255 (2003) 975-989.
[26] 黃忠良 譯著,精密陶瓷加工,民88年,富漢出版社印行。
[27] 橫山巽子 主編,品質設計的實驗計畫法,民88年,中國生產 力中心出版。
[28] 鄭燕琴 編著,田口品質工程技術理論與實務,民84年,中華民國品質管制學會發行。
[29] 吳復強 著,田口品質工程(Quality Engineering),民91年,全威圖書有限公司出版。
[30] 陳耀茂 譯著,田口實驗計畫法(Introduction to Design of Experiment),民88年,滄海書局出版。
[31]趙崇禮,延性加工脆性材料,機械工業雜誌,民83年3月。
[32]丁嘉仁,硬脆基板延性加工技術,機械工業雜誌,民89年8月。
[33]宋健民博士,超硬材料,(2000) 全華科技出版社。