本研究目標為開發客製化設計的晶圓級自動化量測平台，可應用於同一晶片上不同微機電元件之量測。以NI公司的LabVIEW程式做為開發工具，利用所建立的視覺辨識系統找出基準標記及銲墊座標，藉由機器視覺進行晶圓定位以及探針的位置回授，整合自製探針控制機構以及三軸精密晶圓移動平台，完成自動化之客製化晶片量測系統。
　　目前在半導體製程上大多使用探針卡來進行晶圓的檢測，但受限於探針卡自身的設計，需要隨著量測晶片的不同而更換不同的探針卡使用。而在微機電製程中則大多使用晶圓檢測通用探針台進行量測，雖然能夠針對需求改變探針的位置，但是在對位上需要有人工視覺的輔助，在使用上除了耗費人力外也容易產生控制誤差。
　　為了解決上述問題，本研究設計了一自動化量測系統，克服了探針卡需要因應晶片設計而更換的缺點以及通用探針台需人工對位的問題。利用晶圓標記、機器視覺演算法進行晶圓及探針的定位，再搭配自動化調整機構及視覺回授系統把探針移動至需量測的點位進行量測，便能實現針對不同設計之客製化晶片或同一晶片上不同微機電元件之量測，並藉由人機介面告知使用者目前的量測進度以及機器視覺資訊，進而成功建立了全自動化晶圓級量測平台。

This thesis mainly develops an automated wafer-level testing platform for customized design of various devices in the same wafer. It uses LabVIEW, which is developed by National Instruments, as development tool to construct visual identification system for finding fiducial marker and the coordinate of pads. The testing platform, consisting of visual feedback system for wafer positioning and probe identification, self-made probe control system, and three-axis precision mobile stations, can automatically perform the wafer-level testing system for customized design.
Currently, a probe card is mostly used for semiconductor wafer testing. But, probe cards have to be replaced for different design on wafer because of the structure of itself. Besides, it often uses probe station to test wafer in microelectromechanical fabrication. Although probe station can change the location of probes easily, but it needs the vision assistance by humans in alignment. It not only consumes manpower but also leads to control error easier.
　　In order to solve above problems, this thesis develops an automated testing system which overcomes the shortcomings of probe cards and probe stations. With fiducial marker, machine vision algorithms, probe control mechanisms and visual feedback system, the testing system can position the wafer and move the probes to test points for electrical measurements. This testing system can complete testing for different design on wafer, and inform users of current testing progress and machine vision information. Then, the automated wafer-level testing platform for customized design is established successfully.

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