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研究生: 陳偉祥
TAN WEI SIANG
論文名稱: 鈮酸鋰薄膜壓電共振器之製作與特性分析
Fabrication and Characterization of Lithium-Niobate Thin Film MEMS Piezoelectric Resonators
指導教授: 李昇憲
Sheng-Shian Li
口試委員: 徐萬泰
吳名清
學位類別: 碩士
Master
系所名稱: 工學院 - 奈米工程與微系統研究所
Institute of NanoEngineering and MicroSystems
論文出版年: 2015
畢業學年度: 104
語文別: 中文
論文頁數: 97
中文關鍵詞: 單晶X-切面鈮酸鋰薄膜共振器高耦合係數水平剪切模態平板聲波共振器
外文關鍵詞: Single Crystal X-cut Thin Film Lithium Niobate, Resonators, High Coupling Coefficient, Shear Horizontal Acoustic Plate Wave (SH-APM) Resonator
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  • 本文是利用單晶X-切面鈮酸鋰薄膜(Single Crystal X-cut Lithium Niobate, 簡稱X-cut LiNbO3)製作高機電耦合係數(Electromechanical Coupling Coefficient,簡稱kt^2)的水平剪切模態之平板聲波共振器。元件設計初期是利用有限單元分析法(FEM)進行模擬,模擬出SH波模態的頻率與共振時的運動狀態,並且計算出kt^2再與過去文獻之理論計算結果進行比較,以驗證FEM模擬的正確性。根據Kuznetsova et al.的理論計算結果,於X-切面的SH0波模態擁有最高之機電耦合係數27.4%,因此成為本次研究的重點。製程方面,本團隊向國外購買單晶X-切面鈮酸鋰薄膜晶片,並採用表面微加工製程(Surface Micromachining)技術來製作共振器元件。本團隊依據現有學術界有限的製程資源設計了兩種不同的製程流程,並且測試製程的可行性。此製程大致分成三個階段,第一階段為黃光微影,主要負責定義電極與蝕刻槽;第二部分為LiNbO3的蝕刻製程;第三部分為利用氫氟酸(Hydrogen fluoride, 簡稱HF)蝕刻LiNbO3下方的二氧化矽,以讓薄膜釋放,使結構懸浮。此研究製作出來的壓電共振器量測結果之Q值為60,機電轉換係數為15.8%,運動阻抗為28.5 kΩ。


    This work implements single crystal X-cut thin film Lithium Niobate (LN) in order to achieve a high electromechanical coupling coefficient kt^2.of the shear horizontal acoustic plate wave (SH-APM) resonators. The design of the device is carried out by the Finite Element Method (FEM) that can simulate the frequency of the SH0 mode resonators and their mode shape, and we use their frequency response to calculate the coupling coefficient that would be compared with the theoretical analysis and numerical result of prior arts; then we can confirm the validation of our simulation approach. In literature, the resonator possesses a high coupling coefficient at SH0 mode using the X-cut Lithium Niobate, which becomes our target in this work. In the fabrication process, we obtain off-the-shelf single crystal X-cut Lithium Niobate dies and we are using surface micromachining technology to fabricate the resonators. We design two fabrication process flows using the limited academic process resources and test the feasibility of the fabrication process. This process is roughly divided into three parts; the first part is photolithography, primarily responsible for defining the electrodes and etching holes; the present process for fabrication uses two masks. The second part is Lithium Niobate etching process. The third part is to etch the silicon dioxide; thus we use the wet HF to release the thin film structure. This study successfully demonstrated measurement results of the piezoelectric resonator with quality factor of 60, the electromechanical coupling coefficient of 15.8%, and motional impedance of 28.5 kΩ, respectively.

    摘要 ii Abstract iv 誌謝 vi 目錄 viii 圖目錄 xi 表目錄 xv 第一章 前言 1 1-1 研究動機與背景 1 1-2 文獻回顧 5 1-3 內容架構 9 第二章 壓電原理 10 2-1壓電材料介紹 10 2-2 壓電效應 12 2-3 晶體壓電之物理原理 14 2-4 薄膜聲波壓電共振器之原理 18 2-4-1 聲波之種類 18 2-4-2 指叉式電極設計 19 2-5 水平剪切模態之平板聲波 21 第三章 共振器之模擬架構 23 3-1 材料參數 23 3-1-1 歐拉角(Euler Angles) 24 3-2 水平剪切平板聲波壓電共振器模擬 26 3-2-1 Modified Butterworth-Van Dyke等效電路模型 28 3-2-2 COMSOL結構之頻率與元件電性模擬 31 3-2-3 ADS之mBVD等效電路模擬 38 第四章 元件設計與製程 40 4-1 元件設計 40 4-1-1元件之設計與分佈 40 4-1-2 對準元件(Alignment key)與測試元件(Test key)之設計 43 4-2 元件製程 46 4-2-1 LiNbO3 On Insulator (LNOI)之來源與製作 46 4-2-2 Process A之製程流程 49 4-2-3 Process B之製程流程 54 4-3 元件製程的困難與解決方法 58 4-3-1 光罩與光罩之間的對準 58 4-3-2 Hard Mask 之選擇 60 4-3-3 LiNbO3之蝕刻 66 4-3-4 結構釋放 68 第五章 元件量測與結果 71 5-1 雙埠(Two Port)量測架設 71 5-2 量測結果 74 第六章 結論與未來研究 80 參考文獻 82

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