微機電系統(MEMS)包含微機械結構、微感測器與微致動器三大領域。由於微機械加工製造技術不斷地進步，使得各領域元件的發展漸趨成熟。然而微機電系統元件的機械性能表現除取決於機構設計及製程研發外，另外還有一項常被忽略但卻是非常重要的影響因素 – 薄膜材料的機械性質，如果無法精確掌握薄膜材料的機械性質，那麼所製造出來的微機電系統元件，其機械行為將因為機械性質的不確定性而與原先設計有著完全不同的表現﹔是故，一套簡單且精確的薄膜機械性質萃取技術對於系統元件設計是非常重要的。有鑑於此，本論文即以簡單的微機械結構作為載具，在固體力學的基礎下，來萃取薄膜材料的機械性質。並針對不同微細加工製程技術分別敘述如何在體型與面型微細加工製程中萃取與探討薄膜材料的楊氏係數(Young’s Modulus)、蒲松比(Poisson’s Ratio)、熱膨脹係數(Coefficient of Thermal Expansion, CTE)及殘餘應力(Residual stress)等機械性質更；此外，更針對不同的機械常數分別提出兩種不同的萃取方法，作為相互驗證之用，提高萃取的準確性。另外對於薄膜材料的熱疲勞現象也作了初步的探討。而本論文中所提出的薄膜機械性質萃取技術，各個單一技術除了可以單獨使用來作為系統元件批量製造時的材料機械性質測試鍵(Test-key)使用外，還可以結合其他單一技術然後形成一個完整且功能性更高的測試鍵群組。

Microelectromechanical system (MEMS) contains microsensors, microactuators, micromechanical structures, and integrated circuits. Since the micromachining fabrication processes are improved drastically, plenty of micromachined devices have been developed and commercialized presently. However the performance of these devices are not only depend s on the geometry design and fabrication process improvement, but on the control of mechanical properties of thin film materials. The mechanical properties, which are important issues but generally ignored by designer, usually make the devices have a deviated performance different from its initial design. Therefore, a simple and accurate method to characterize the mechanical properties of thin film materials is very important.
This thesis intends to characterize the mechanical properties of thin film materials using the micromachined structures. Base on the solid mechanics, the mechanical properties such as Young’s modulus, Poisson’s ratio and coefficient of thermal expansion are characterized by micromachined structures under different micromachining processes (Bulk/Surface micromachining). At least two types of characterized mechanisms were exploited to characterize each of mechanical properties for improving the accuracy. Furthermore, the thermal behaviors of thin films were also being discussed. Finally, every characterized mechanism exploited in this thesis not only can role as test key to characterize the mechanical property of thin film during the batch fabrication of devices, but also combined with other mechanism to be a test key group with more performance.

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