在半導體晶圓廠之複雜生產環境之下，由於包含數百種製程機台以及數十種不同製程步驟，因此僅僅利用數個單一指標來描述各個機台的績效是相當困難且無法考量全面的。相關研究提出綜合設備效率(OEE)以量測與計算單一機台之整體績效，並解決單一績效指標之間的衝突與抵換。由於半導體機台數目眾多，機台並依照製程特性分類成不同的機台群組，管理者很難針對每一台機台的綜合設備效率來管理設備，因此本研究定義群組綜合設備效率(GOEE)以利描述機台群組之績效。此外，既有研究主要針對一段觀測期間之內的機台綜合設備效率，而非持續地針對OEE作即時監控與診斷。
本研究針對監控與診斷半導體設備績效提出一個整合性的架構，並考量機台群組與時間兩個維度以定義相對應的設備效率指標。接著提出以統計製程管制為基礎的長期性設備效率指標之分析，透過群組OEE及其變異之管制圖來監控機台即時績效。根據OEE及其變異之不同組合情況，可將機台群組劃分為四個大類，並說明各類型之機台群組之特性及優劣，進而列舉可能造成群組類型變化之原因。機台管理者可透過個別機台之OEE趨勢圖來指出重點機台，並分析其機台內部時間區段，以診斷出可能造成績效損失的因子。最後，機台管理者根據損失因子之特性提出相關的改善方法，進一步提昇廠內重點機台的績效，以達成整廠機台管理之目的。

In order to define and measure the overall performance of equipment, Overall Equipment Efficiency (OEE) has been proposed to consider the trade-off between traditional stand-alone metrics. OEE represents a comprehensive index for single equipment performance. Due to the growing of the number of equipment in factories, it becomes more difficult to manage single machine OEE one by one. In this study, group OEE (GOEE) is proposed to observe the equipment performance on group level. In addition, existing studies focus on the analysis of equipment OEE during a period of observing time. Nevertheless, it is also essential to continuously monitor OEE from time to time.
This study aims to construct a framework for monitoring equipment performance and diagnosing root causes of performance losses. In particular, we define OEE-related metrics that consider two dimensions: equipment group and time. Longitudinal analysis on OEE monitors the long-term equipment performance by statistical efficiency control charts. After several critical time intervals are found to have OEE down, root cause analysis is then utilized to identify possible performance detractors: crucial machine statuses. By prioritizing the performance loss factors according to their proportion of OEE loss, analyzers can determine that which machine or machine group should be the focus for management. Improvement actions can be triggered on those critical machine statuses to promote equipment performance.

Ames, V. A., Gililland, J. and Konopka, J., (1995), Overall Equipment Effectiveness (OEE) Guidebook Revision 1.0.
Auches, B., Grewal, G. and Silverman, P. (1995), "Managing multi-chamber tool productivity," in Proceedings of Advanced Semiconductor Manufacturing Conference and Workshop, pp.240-247.
Clemen, R. T. and Reilly, T., (2001), Making Hard Decisions with Decision Tools, Belmont CA: Duxbury Press.
DeRon, A. J. and Rooda, J. E. (2005), “Equipment Effectiveness: OEE Revisited,” IEEE Transactions on Semiconductor Manufacturing, Vol. 18, No. 1, pp. 190-196.
Freck, R. W. (2000), “Using Overall Equipment Effectiveness (OEE) and the Equipment Improvement Process (ET) to Improve Fab Throughput,” in Proceedings of Advanced Semiconductor Manufacturing Conference and Workshop, pp. 469-471.
Freck, R. W. (2000), “Using Overall Equipment Effectiveness (OEE) and the Equipment Improvement Process (ET) to improve Fab Throughput,” in Proceedings of Advanced Semiconductor Manufacturing Conference and Workshop, pp. 469-471.
Gouvea, S. and Pinheiro, E. (2002), “Uses and Misuses of the Overall Equipment Effectiveness for Production Management,” in Proceedings of IEEE International Engineering Management Conference, Vol. 2, pp. 1-7.
Hopp, W. J. and Spearman M. L. (2000), Factory Physics 2nd edition, McGraw-Hill.
Jeong, K. (2001), “Operational Efficiency and Effectiveness Measurement,” International Journal of Operations and Production Management, Vol. 21, No. 11, pp. 1404-1416.
Jonsson, P. and Lesshammar, M. (1999), “Evaluation and Improvement of Manufacturing Performance Measurement Systems—The Role of OEE,” International Journal of Operations and Production Management, vol. 19, no. 1, pp. 55–78.
Jula, P. and Spanos, C. J. (2005), “Comparing the Economic Impact of Alternative Metrology Methods in Semiconductor Manufacturing,” IEEE Transactions on Semiconductor Manufacturing, Vol. 15, No. 4, pp. 454-463.
Leachman, R. C. (1996), “Benchmarking Semiconductor Manufacturing,” IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. 2, pp. 158-169.
Leachman, R. C. (1997), “Closed-Loop Measurement of Equipment Efficiency and Equipment Capacity,” IEEE Transactions on Semiconductor Manufacturing, Vol. 10, No. 1, pp. 84-97.
Ljungberg, Õ. (1998), “Measurement of Overall Equipment Effectiveness as a Basis for TPM Activities,” International Journal of Operations and Production Management, Vol. 18, No. 5, pp. 495-507.
Lopez, M. J. and Wood, S. C. (1998), “Systems of Multiple Cluster Tools: Configuration and Performance under Perfect Reliability,” IEEE Transactions on Semiconductor Manufacturing, Vol. 11, No. 3, pp. 465-474.
Martin, D. P. (1993), “Key Factors in Designing a Manufacturing Line to Maximize Tool Utilization and Minimize Turnaround Time,” in Proceedings of the 4th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.48-53.
Martin, D. P. (1999), "Total operational efficiency (TOE): the determination of two capacity and cycle time components and their relationship to productivity improvements in a semiconductor manufacturing line," in Proceedings of IEEE/SEMI Advanced Semiconductor, pp. 37-41.
Martin, D. P. (2001), “Determining the Capacity Components of Different Classes of Multi Chamber Tools,” in Proceedings of Advanced Semiconductor Manufacturing Conference and Workshop, pp. 29-38.
Martin, D., McClintock M., and Woods R. (2000), "Determining Capacity Components of Multi-Chamber Systems," in Proceedings of the 11th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp.466-468.
Naguib, H. (1993), “A Roadmap for the Implementation of TPM in a Semiconductor Operation,” in Proceedings of IEEE International Semiconductor Manufacturing Science Symposium, pp. 29-38.
Nakajima, S. (1988), Introduction to Total Productive Maintenance, Cambridge, MA: Productivity Press.
Nakajima, Seiichi (1989), TPM Development Program, Cambridge, MA: Productivity Press, Inc.
Neely, A. (1999), “The performance measurement revolution: why now and what next,” International Journal of Operations and Production Management, vol. 19, no. 2, pp. 205–228.
Perkinson, T. L., McLarty, P. K. and Gyurcsik S. (1996), “Single-Wafer Cluster Tool Performance: An Analysis of the Effects of Redundant Chambers and Revisitation Sequence on Throughput,” IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. 3, pp. 384-400.
Perkinson, T. L., McLarty, P. K., Gyurcsik S. and Cavin III, R. K. (1994), “Single-Wafer Cluster Tool Performance: An Analysis of Throughput,” IEEE Transactions on Semiconductor Manufacturing, Vol. 7, No. 3, pp. 369-373.
Pollitt, C. and Matthews, J. (1998), "Quantifying Capacity Loss Associated with Staffing in a Semiconductor Manufacturing Line," in Proceedings of Advanced Semiconductor Manufacturing Conference and Workshop, pp.133-137.
Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM), Semiconductor Equipment and Material International (SEMI) E10-0701, 2001.
Standard for Definition and Measurement of Equipment Productivity, Semiconductor Equipment and Material International (SEMI) E79-0200, 2000.