本篇論文提出了一個新的寫入方式，稱為方法(A)，此方法為將源極接面順偏，使得電流密度增加，進而注入電流密度也會增加，實驗結果發現寫入速度比通道熱載子注入法快了約10倍，此方法的缺點為基板漏電流太大。
利用2D元件模擬軟體-Medici分析，發現此方法注入電流較大的原因為：電流密度的分佈與注入機率密度的分佈重疊面積較大，兩者相乘之下，使得注入電流密度比通道熱載子注入法大，所以寫入速度較快。

本篇論文也針對源極抹除與通道抹除作一比較，比較的項目有：臨界電壓的偏移、抹除速度、氧化層接面陷住電荷的多寡，結果發現本實驗樣是比較適合源極抹除，其抹除速度較快，臨界電壓在施加應力後，臨界電壓的偏移量較小，汲極接面的Not量也比較小，傷害多半集中在源極接面。

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