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研究生: 廖冠勛
Liao, Kuan-Hsun
論文名稱: 應用焦耳熱效應之熱阻式應變感測元件
A Thermoresistive Strain Sensing Device Based on Joule Heating Effect
指導教授: 羅丞曜
Lo, Cheng-Yao
口試委員: 廖英志
Liao, Ying-Chih
莊承鑫
Chuang, Cheng-Hsin
陳錦泰
Chen, Chin-Tai
林承忠
Lin, Cheng-Chung
學位類別: 博士
Doctor
系所名稱: 工學院 - 奈米工程與微系統研究所
Institute of NanoEngineering and MicroSystems
論文出版年: 2019
畢業學年度: 107
語文別: 中文
論文頁數: 177
中文關鍵詞: 卷對卷製程紅外線焦耳熱感測器應變聚萘二甲酸乙二醇酯噴墨印刷熱阻
外文關鍵詞: Inkjet printing, infrared, Joule heating, polyethylenenaphthalate, roll-to-roll, sensor, strain, thermoresistive
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  • 本論文提出一種焦耳熱應變感測元件,提供小區域形變定量及定位之技術,監測因形變導致之焦耳熱能差異並透過觀察表面小區域溫度分布獲取應變解析。針對不同量測精度及測定區範圍,透過微影及噴墨印刷製程製作感測元件,並藉由金屬材料選用、基材適用性、能量估算匹配及設計理論之實踐,證明不論是正向、負向彎曲之曲面或不均勻拉伸之區域皆能藉此技術呈現形變程度,且能針對全測定區進行應變解析。
    研究初期經力學理論推導配合有限元素多重物理量耦合理論,對熱、電及受力進行分析,設計合適的元件及匹配的電流電壓,而後分別選擇機械性質良好之金屬利用微影製程製作感測元件。噴印製程採適應性良好奈米銀墨水噴製,並透過調變壓電元件供墨波形、噴頭施加電壓、噴頭溫度、墨滴間距、基板溫度、噴印高度及墨水與基材間作用力等,實現設計之應變感測元件。針對小區域應變及不均勻拉伸則分別利用微影元件與噴墨印刷元件進行交叉驗證比對,結果證明了小區域應變解析及全測定區應變分布監測可行性。除監測透過自然彎曲產生均勻形變之元件外,本研究亦利用微影元件進行小曲率半徑之監測,於塑性變形區域實踐了小曲率半徑之應變監控。噴印元件部分利用客製化夾治具模擬卷對卷軸偏時不均勻應變,於塑性變形區間進行量測,並藉由溫度應變資料庫比對,證明夾具所產生之應變對應溫度與數據庫相符,亦印證了噴印感測元件於塑性變形區間之適用性。
    製程中採閃光燒結技術取代熱燒結,預先為與卷對卷製程垂直整合做準備,並透過覆蓋光固化樹脂達到提升感測靈敏度及降低雜訊之成效。透過此研究設計之系統將可實踐軟性電子於卷對卷製程軸偏之連續監測,可有效杜絕印刷滾軸偏差,提升印刷品質及良率。


    A thermoresistive strain sensor composed of a meandering resistor and a substrate is realized by the roll-to-roll (R2R) manufacturing-compatible procedures in this study. The sensing principles of the thermoresistive strain sensor are based on Joule heating and infrared (IR) inspection. At the beginning of this research, the mechanic theory from the finite element multi-physical quantity coupling theory was confirmed. The operating conditions of heat, electricity, and force of the device, and appropriate operating current and voltage were taken into account. A serpentine metal line is patterned on a polymer substrate to form the strain sensor in accordance with thermoresistive behavior, and the strain sensor is subjected to either effective current or voltage to induce the Joule heating on the resistor. An infrared (IR) detector is used to monitor the strain-induced temperature difference and the minimal detectable bending radius is 0.87 mm with a gauge factor (GF) of 146. The proposed design eliminates the ambiguity of judgement compared with conventional resistive strain sensors, where resistance is the only physical factor. Moreover, consecutive operations of sensor patterning by an inkjet printing, material stabilization by flashlight sintering, thermal emission by Joule heating, and strain evaluation by IR inspection were successfully demonstrated by an in-line method, which indicated strains distributed in an arbitrary area of a transparent substrate. The thermoresistive strain sensor and its detection method can be applied in the evaluations of symmetric tension and compression to various extents, regardless of the form of power. In addition, the effectiveness of the detection method on off-axis or asymmetric substrate deformation was examined. Besides its tunable sensitivity and gauge factor for operational flexibility, the high sensitivity and the largest gauge factor existed. This study revealed that the device can be successfully used to analyze the local strains and perform the precise measurement.

    摘要 I Abstract III 致謝 V 目錄 VI 圖目錄 XIII 表目錄 XX 符號表 XXI 第一章 序論 1 1.1前言 1 1.2軟性電子的發展背景 2 1.3應變感測元件(應變規)總覽 4 1.3.1法布立-培若干涉式 5 1.3.2 布拉格繞射式 6 1.3.3 墨瑞效應式 6 1.3.4電阻式 6 1.3.5壓電式 8 1.3.6表面超音波式 9 1.3.7電容式 9 1.3.8光纖式 10 1.3.9電阻式應變感測元件比較 10 1.3.10卷對卷系統軸偏監測 10 1.4感測元件效能簡介 11 1.4.1感測系統機制 11 1.4.2感測元件分類 11 1.4.3傳感效能決定因素 12 1.4.3.1選擇性 12 1.4.3.2靈敏度 12 1.4.3.3準確性、精確性及再現性 13 1.4.3.4反應時間 13 1.4.3.5回復時間 14 1.4.3.6運作壽命 14 1.5研究動機 14 1.6研究目標 16 1.6.1黃光微影 17 1.6.2噴墨印刷 17 1.6.3印刷技術適用性分析 19 1.7論文架構 19 第二章 熱阻式應變感測元件設計 44 2.1 紅外線溫度偵測與放射理論 44 2.1.1 力學形變理論 46 2.1.2 焦耳熱效應理論分析 47 2.2 元件設計 48 2.2.1 量測區域觀點 48 2.2.2 材料選用與匹配 48 2.2.3 圖形定義觀點 49 2.2.4 焦耳熱效應操作適用性 50 2.2.5 基材特性評估 51 2.2.6 元件線路設計 51 2.2.7 燒結觀點 52 2.2.8 製程自動化的觀點 52 2.3 熱模擬 53 2.3.1微影製作之元件模擬 54 2.3.2噴印元件模擬 55 2.4 元件影響因子測試 56 2.4.1 元件溫度效應 57 2.4.2 可靠度測試 57 2.4.3 元件抗拉測試 58 2.4.4 表面粗糙度分析 58 2.5感測效能評估與設計 59 第三章 感測元件之製作 79 3.1 整體實驗流程 79 3.2微影製程 79 3.3 噴印製程 81 3.3.1噴印感測元件製作流程 82 3.3.2 噴印品質決定因子 82 3.3.3 奈米粒子燒結 86 3.3.3.1 熱燒結 87 3.3.3.2 閃光燒結 88 第四章 結果與討論 106 4.1 紅外光應變測試系統 106 4.1.1 弧面自然彎曲應變量測法 108 4.1.2 焦耳熱能量選擇與匹配 109 4.1.3 紅外線量測概述 110 4.1.4 反應時間與穩定度 111 4.2 自然弧度微影元件應變量測 111 4.2.1 微影元件拉伸應變監測 112 4.2.2 微影元件壓縮應變監測 113 4.3 小區域應變解析實測 113 4.4 自然弧度噴印元件應變量測 114 4.4.1 噴印元件拉伸應變測試 115 4.4.2 噴印元件壓縮應變測試 115 4.5 噴印元件不均應變實測 116 4.6 元件效能探討與實踐 118 4.6.1 靈敏度優化元件模擬 118 4.6.2 靈敏度優化元件製作 120 4.6.2.1 覆蓋層決定因子 120 4.6.2.2 覆蓋層製作及固化 121 4.6.3 元件應變量測 121 4.6.3.1 靈敏度優化元件拉伸應變測試 122 4.6.3.2 靈敏度優化元件壓縮應變測試 123 第五章 結論與未來展望 158 5.1結論 158 5.2 技術創新及優點分析 159 5.3 未來展望 163 5.3.1 卷對卷製程應用 163 5.3.2 軸偏修正自動化 163 參考文獻 166 著作列表 175

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