隨著電路訊號的上升時間越來越短，系統的操作頻率已達到十億赫茲(GHz)的範圍，所以必須把金屬連接當作傳輸線來看。在封裝、印刷電路板和超大型積體電路的低頻設計中，連接著不同元件之間的金屬連接線還不會影響訊號傳遞的表現；但在射頻設計中，已必須使用準確且有效率的方法進行模擬。因為在產品中使用射頻已經是一個趨勢，所以在產品封裝時所使用的連接線必須視為傳輸線來看。製程越來越先進，電路也越來越複雜，預先共同設計的方法因此被提出，而利用準確的傳輸線模型，不但可使產品降低成本同時提升電路表現。
乘載訊號頻率在高頻電路系統中增加，偶合效應以及電磁干擾等問題逐漸出現。為了改善訊號的完整性，因而開始使用兩條平行傳輸線構成的差動傳輸模式訊號。在先進積體電路封裝技術中，不僅兩個端點的網路分析已經行之有年，就連四個端點的用量也越來愈頻繁。
在射頻訊號或是微波電路分析中，頻域的散射參數已經被廣泛的使用，可描述多個端點的網路分析；射頻參數可以簡單的利用矩陣的方式表達。而現今工業界也都已經有建立量測射頻參數的儀器。對電路設計者而言，利用類似SPICE這種軟體工具驗證時域的訊號也是相當必須的。電子設計自動化軟體必須利用準確地的傳輸線等效電路模型才可以執行正確的電路模擬，否則將會失去模擬的意義。在這篇論文當中，傳輸線的電性特徵是利用散佈式RLCGK當作模型，且這些電性參數是利用三維的電磁模擬軟體抽取。
我們在此論文中提出了可以在頻域和時域間相互轉換的方法，利用HSPICE和Matlab量化這些數值且進行驗證的工作。如此，電路設計者更容易觀察高頻的傳輸線的行為，並且減少誤用參數的可能性，進一步提升設計電路的便利性與準確性。

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