在現今的LTCC製程技術以CFG的方法較為被廣泛地使用，其高頻微波的介電性質、燒結緻密溫度，需考量陶瓷固相與玻璃液相的材料選擇。為了達到低介電損失及低溫共燒的目的，陶瓷材料的選擇以類鎢青銅結構的Ba4(Nd0.85Bi0.15)9.33Ti18O54 (BNBT)作為基材，其具有較高品質因子與介電常數，以及相對小的共振頻率溫度係數。而玻璃材料的選擇則採用低熔點的Li2O-ZnO-B2O3 (LZB)玻璃系統，作為助燒劑。首先，於論文第一章主要介紹玻璃形成的結構理論、硼酸鹽玻璃系統以及Ba6-3xR8+2xTi18O54的陶瓷系統的結構與性質的關係，並回顧低溫共燒的製程技術以及所面臨的問題。而在論文的第二章，以三成分系鋰鋅硼酸鹽玻璃系統(Li2O-ZnO-B2O3, LZB)為研究對象，利用固態核磁共振儀(NMR)與X光吸收光譜術(XAS)作為玻璃結構主要的分析儀器。從11B MAS-NMR光譜分析顯示四配位硼佔有的比例(N4)與非架橋氧(NBO)的數目受到Li2O含量以及ZnO/B2O3比例影響。並藉由Zn K-edge的延伸X光吸收精細結構(EXAFS)分析，可知鋅的配位數大小約為3.01-3.64，暗示在LZB玻璃系統中，除了B2O3作為主要玻璃網絡形成劑之外，ZnO亦扮演形成劑之角色。此外，利用EI-Hofy、Mackenzie與Appen方法計算玻璃轉移溫度(Tg)、線性熱膨脹係數()、介電常數(r)與折射率(nD)，並比較計算值與實驗值之間的差異，顯示理論計算的結果僅略大於實驗值，且其趨勢變化與實驗值一致，暗示上述理論計算的方法有助於LZB玻璃性質的預測與成分設計。
接著，論文第三章以添加LZB玻璃對BNBT陶瓷的燒結行為以及介電性質的分析。當添加10 vol%的LZB玻璃於BNBT陶瓷內(BNBT+LZB系統)，可有效地將燒結緻密的溫度從1300oC降低至875-900oC。而BNBT+LZB系統的緻密性質與LZB玻璃的軟化溫度Ts、Td有關，玻璃軟化溫度的變化已在第二章有詳細地討論，其大小隨Li2O含量增加而下降，約為520-600oC之間，此結果可從BNBT+LZB系統的TMA收縮曲線觀察發現，顯示在軟化溫度範圍下開始出現明顯的線性收縮變化。此外，又從BNBT+LZB系統的顯微結構觀察及X光繞射結晶相分析，顯示LZB玻璃/BNBT陶瓷的介面在燒結過程產生反應，隨LZB玻璃組成的Li2O含量增加而生成雜相的比例降低，則殘留的LZB玻璃含量較多，導致BNBT+LZB系統的緻密度增加。對於90 vol% BNBT+10 vol% LZB 系統而言，在5-5.79 GHz的共振頻率下量測獲得的介電常數(r)約為55-70，品質因子(Q)與共振頻率(fr)的乘積(Q x fr)為1,000-3,000 GHz，而在25-80oC溫度範圍的共振頻率溫度係數(tf)為10-60 ppm/oC。
本文探討以銀為內電極的積層陶瓷電容器(MLCC)其受到溫度及電壓影響下所造成的失效機制。MLCC的介電層材料為陶瓷+玻璃的複合系統，成分組成為90 vol % Ba4(Nd0.85Bi0.15)9.33Ti18O54 (BNBT) +10 vol % Li2O-ZnO-B2O3 (LZB)的陶瓷玻璃系統，其可與Ag內電極低溫共燒於875-900oC，達到良好的緻密性。從I-V曲線及HALT的結果發現失效後的元件不再遵守歐姆定律，且元件隨著溫度或電壓提高而縮短了失效的時間(TTF)。藉由TEM/EDS的微觀結構觀察及成分鑑定、SIMS半定量分析銀的擴散活化能及擴散係數、以及阻抗頻譜模擬分析材料的等效電路模型，上述結果皆顯示Ag+離子在高溫或高電壓下的擴散與(電)遷移主要發生在LZB玻璃相上。

第一章
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第二章
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第三章
[1] R. R. Tummala, “Ceramic and Glass-Ceramic Packaging in the 1990s,” J. Am. Ceram. Soc., 74 [2] 895-908 (1991).

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[20] D. W. Kim, D. G. Lee, and K. S. Hong, “Low-Temperature Firing and Microwave Dielectric Properties of BaTi4O9 with Zn-B-O Glass System,” Mater. Res. Bull., 36 [3-4] 585-95 (2001).

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[25] V. C. V. Gowda and R. V. Anavekar, “Elastic Properties and Spectroscopic Studies of Na2O-ZnO-B2O3 Glass System,” Bull. Mat. Sci., 27 [2] 199-205 (2004).

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第四章
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[2] T. J. Lu and N. A. Fleck, “The Thermal Shock Resistance of Solids,” Acta Mater., 46 [13] 4755-68 (1998).

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[5] R. K. Bordia and A. Jagota, “Crack Growth and Damage in Constrained Sintering Films,” J. Am. Ceram. Soc., 76 [10] 2475-85 (1993).

[6] C. Hillman, Z. G. Suo, and F. F. Lange, “Cracking of Laminates Subjected to Biaxial Tensile Stresses,” J. Am. Ceram. Soc., 79 [8] 2127-33 (1996).

[7] T. N. Cheng and R. Raj, “Flaw Generation During Constrained Sintering of Metal-Ceramic and Metal-Glass Multilayer Films,” J. Am. Ceram. Soc., 72 [9] 1649-55 (1989).

[8] C. H. Hsueh and A. G. Evans, “Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging,” J. Am. Ceram. Soc., 68 [3] 120-7 (1985).

[9] R. K. Bordia and R. Raj, “Sintering Behavior of Ceramic Films Constrained by a Rigid Substrate,” J. Am. Ceram. Soc., 68 [6] 287-92 (1985).

[10] H. Kishi, Y. Mizuno, and H. Chazono, “Base-Metal Electrode-Multilayer Ceramic Capacitors: Past, Present and Future Perspectives,” Jpn. J. Appl. Phys. Part 1 - Regul. Pap. Short Notes Rev. Pap., 42 [1] 1-15 (2003).

[11] C. C. Chou, C. S. Chen, P. C. Wu, K. C. Feng, and L. W. Chu, “Influence of Glass Compositions on the Microstructure and Dielectric Properties of Low Temperature Fired BaTi4O9 Microwave Material with Copper Electrodes in Reducing Atmosphere,” Ceram. Int., 38 S159-62 (2012).

[12] C. L. Chen, W. H. Lee, and W. C. J. Wei, “Sintering Behavior and Interfacial Analysis of Ni/Cu Electrode with BaTiO3 Particulates,” J. Electroceram., 14 [1] 25-36 (2005).

[13] C. C. Lin, W. C. J. Wei, C. Y. Su, and C. H. Hsueh, “Oxidation of Ni Electrode in BaTiO3 Based Multilayer Ceramic Capacitor (MLCC),” J. Alloy. Compd., 485 [1-2] 653-59 (2009).

[14] G. Y. Yang, S. I. Lee, Z. J. Liu, C. J. Anthony, E. C. Dickey, Z. K. Liu, and C. A. Randall, “Effect of Local Oxygen Activity on Ni-BaTiO3 Interfacial Reactions,” Acta Mater., 54 [13] 3513-23 (2006).

[15] K. B. Shim, N. T. Cho, and S. W. Lee, “Silver Diffusion and Microstructure in LTCC Multilayer Couplers for High Frequency Applications,” J. Mater. Sci., 35 [4] 813-20 (2000).

[16] N. J. Donnelly and C. A. Randall, “Refined Model of Electromigration of Ag/Pd Electrodes in Multilayer PZT Ceramics Under Extreme Humidity,” J. Am. Ceram. Soc., 92 [2] 405-10 (2009).

[17] R. Z. Zuo, L. T. Li, Z. L. Gui, C. X. Ji, and X. B. Hu, “Vapor Diffusion of Silver in Cofired Silver/Palladium-Ferroelectric Ceramic Multilayer,” Mater. Sci. Eng. B-Solid State Mater. Adv. Technol., 83 [1-3] 152-57 (2001).

[18] J. E. Sergent and C. A. Harper, Hybrid Microelectronics Handbook. 2nd ed.; pp. 3-1-38, McGraw-Hill, Inc., New York, 1995.

[19] D. W. Kim, D. G. Lee, and K. S. Hong, “Low-Temperature Firing and Microwave Dielectric Properties of BaTi4O9 with Zn-B-O Glass System,” Mater. Res. Bull., 36 [3-4] 585-95 (2001).

[20] O. Dernovsek, A. Naeini, G. Preu, W. Wersing, M. Eberstein, and W. A. Schiller, “LTCC Glass-Ceramic Composites for Microwave Application,” J. Eur. Ceram. Soc., 21 [10-11] 1693-7 (2001).
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