藉由環境應力、剝離與往復荷重測試等機械性質評估，嘗試鑑別無膠系銅箔/聚亞醯胺(Cu/PI)之機械性質、可靠度準則及產品生命週期。利用一系列不同結構厚度的Cu/PI試片進行，不同的機械性質表現可利用統計歸納的方式進行比較。在剝離測試下，18μm的銅箔搭配20μm的PI膜於溫度85 °C及相對溼度85% 操作條件下表現較佳的接合強度特性。可預期的，試片在經歷85 °C/85% RH 與150 °C、240h等環境應力測試，並與室溫下正常儲存3年的產品進行機械可靠度性質比較，其結果與高濕、高溫狀態(85 °C/85% RH)相近，並將依此作為產品壽期預測準則。
由於機械應力累積因素，Cu/PI試片經由往復荷重測試其失效區域均落在靠近銅(Cu)箔端的界面，其中探討裂隙與不同Cu/PI結構厚度關聯性可藉由荷重測試儀QC-104 COMETECH 及電子顯微鏡(FE-SEM) 進行確認。經分析研判，影響銅箔端裂隙生成主要是來自不同的PI膜厚度，同時藉由微觀結構評估及不同機械性質測試 可進一步確認其失效模式及裂隙成長機制。
本研究主要以系統化的測試方式針對不同結構厚度Cu/PI進行機械性質評估。另外，經由大量數據分析明確定義Cu/PI在印刷電路板(PCB)及電子產業的生命應用週期及表面品質改善的關鍵因素，最佳提升生產良率的條件是在組裝前進行表面潔淨度控制。希望藉由上述的模式建立與分析結果，對蓬勃發展的PCB及電子產業有所貢獻。

The criteria of reliability, mechanical property and aging lifetime in adhesiveless copper/polyimide (Cu/PI) can be identified and described by distinct environmental stress testing, peel strength testing and cyclic loading testing. Systematic samples of various assembly structural thickness of Cu/PI were employed and investigated in this study. The statistical values of mechanical performances were calculated and compared. In peel strength, better adhesive performance of the PI film was set as 20 μm and copper to 18 μm. However, the comparative calculations of the better peel performance at 85 °C/85% RH condition. It is expected that through comparison between 85 °C/85% RH and 150 °C after 240h in mechanical reliability, a criterion of lifetime can be predicted by 85 °C/85% RH which has been used to realize the changes occurred during operation or storage in real situations. To compare with the identical structures were maintained at room temperature and normal relative humidity for a period of three years. The results are close to those obtained for the 85 °C/85% RH conditions. It is assured that this test can be applied to predict the lifetime following a period of three years.
Most failure regions existed at interface of Cu side in cyclic loading test due to the stress accumulation. The correlation between the crack generation and different structural Cu/PI composite were established on the QC-104 COMETECH test machine via field-emission scanning electron microscopy (FE-SEM). According to the trend, the Cu influence was focused in both attachment and assembly with various PI film. The microstructure evolution, different mechanical reliability vehicle, failure mode and crack generation of Cu in the attachment and assembly with critical PI film thickness.
This research is to set up a systematic method to evaluate the mechanical reliability in different construction of Cu/PI composite. In addition, a large amount of data base were collected to identify the relationship of lifetime and to reveal the critical factor of surface improvement for attached Cu/PI in the PCBs and electronic industries. The optimal conditions for the surface cleaning could be pre-controlled in the attachment Cu/PI assembly, and the yield enhancement in fabrication was further conducted. It is expected that the effort and results in this study should provide a potential contribution for PCBs and electronic industries.

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