本論文的研究目的是探討影響氮化鈦薄膜於鈦合金Ti-6Al-4V的附著度之因素。第一部份，利用中空陰極離子鍍著(HCD-IP)系統於低功率下將氮化鈦薄膜鍍著於矽基材上，研究在低功率下，三種鍍膜參數對樣品性質的影響，調整的參數有基板偏壓、鍍膜功率及工作壓力，並比較各樣品的厚度、粗糙度、電阻率、硬度及殘餘壓應力與不同鍍膜參數之間的關係。結果顯示，當基板偏壓提升至-90V時，薄膜的硬度及殘餘壓應力提升；當鍍膜功率由2.2提升至2.4 kW時，膜厚增加了將近一倍，由於所有樣品的鍍膜時間皆為35分鐘，說明了膜厚的增加主要來自功率的貢獻，而當功率由2.4提升至2.6 kW時，雖然膜厚的增加程度變為趨緩，只增加約200 nm，但整體而言，膜厚與功率仍呈正向趨勢，特別的是，較高的鍍膜速率並沒有降低薄膜之品質，由殘餘應力及硬度的數值可看出薄膜仍有良好的抵禦外力之能力；在功率為2.2 kW的情況下將工作壓力由3提升至4 mTorr，發現膜厚減少，表示可能有re-sputtering的現象，進而使鍍率下降。第二部份為利用HCD-IP於低功率下將氮化鈦薄膜鍍著於鈦合金Ti-6Al-4V上，欲探討影響氮化鈦薄膜於Ti-6Al-4V上的刮痕結果的主要因素。藉由調整各樣參數，比較鍍膜參數及臨界應力的關係，最終結果顯示使用基板偏壓-60V、鍍膜功率2.4 kW及工作壓力3 mTorr製備之厚度為1.4 μm的TiN，其刮痕結果中的臨界應力(LC3)，平均可高達約42 N，與其他文獻相比，此結果表明了單層TiN與Ti-6Al-4V具有良好的附著度。然而，沒有任何一項數值(楊氏係數、殘餘應力、儲存能等)和LC3有高相關性，考量刮痕測試中，整個過程是使用鑽石針對薄膜施加應力並刮除薄膜，進而獲得刮除薄膜所需施加的最大應力(LC3)，因此本研究將LC3除以氮化鈦薄膜厚度，獲得移除1nm之氮化鈦薄膜所需施加之應力(LC3’)，再與楊氏係數、殘餘應力及儲存能比較，發現LC3’與這三樣數據的高相關性，此相關性可用於預測刮痕測試的結果，而不用破壞試片。

The purpose of this study is to explore the factors affecting the adhesion of titanium nitride films to titanium alloy Ti-6Al-4V. In the first part, the hollow cathode ion plating (HCD-IP) system is used to deposit titanium nitride thin films on silicon substrates at low power, and the effects of three coating parameters on the sample properties at low power are studied. The adjusted parameters include substrate bias, coating power and working pressure, and the relationship between the thickness, roughness, resistivity, hardness and residual compressive stress of each sample and different coating parameters is compared. The results show that when the substrate bias voltage is increased to -90V, the hardness and residual compressive stress of the film increase; when the coating power is increased from 2.2 to 2.4 kW, the film thickness nearly doubles, because the coating time of all samples is 35 minutes, indicating that the increase in film thickness mainly comes from the contribution of power. When the power is increased from 2.4 to 2.6 kW, although the increase in film thickness slows down and only increases by about 200 nm, overall, the film thickness and power still show a positive trend. In particular, the higher coating rate does not make the film less dense. The values of residual stress and hardness show that the film still has good quality; when the working pressure was increased from 3 to 4 mTorr at a power of 2.2 kW, it was found that the film thickness decreased, indicating that there may be re-sputtering, which in turn caused the deposition rate to decrease. The second part is to use HCD-IP to deposit titanium nitride film on titanium alloy Ti-6Al-4V under low gun power. It is intended to explore the main factors that affect the scratch results of titanium nitride film on Ti-6Al-4V. By adjusting various parameters and comparing the relationship between coating parameters and critical load (LC3), it’s found that the critical load (LC3) of titanium nitride film can be as high as about 42 N on average with using a substrate bias voltage of -60V, a gun power of 2.4 kW and a working pressure of 3 mTorr. Compared with other literature, this result shows that the single layer of titanium nitride has good adhesion to Ti-6Al-4V. However, none of the values (Young's modulus, compressive residual stress, stored energy, etc.) has a high correlation with LC3. Considering the scratch test, the entire process is to use diamond needle to apply load to the film and scrape off the film, thereby obtaining the maximum load (LC3) as the film removed completely. In this study, the LC3 is divided by the thickness of the titanium nitride film to obtain the stress that needs to be applied to remove a 1nm titanium nitride film (LC3’). Comparing LC3’ with Young's modulus, compressive residual stress and storage energy, it revealed a high correlation between LC3’ and these three values, which can use to predict the scratch result without doing destructive testing.

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