本研究針對半導體封裝廠進行一產能組態規劃問題探討，案例公司所面臨之問題，主要分為兩個部分，其一為機台與模具配置，主要為針對不同產線間之機台數量配置規劃，其二為多產品之產量分配問題，在這問題中所追求之目標為淨利潤最大。此產能組態規劃問題主要探討半導體封裝廠中三站瓶頸站別，分別為黏晶站、銲線站以及封膜站，此問題存在高度的複雜性包含產品可加工機群之限制與機台配置的限制、機台類型存在非等效平行機台之特性、及產品種類眾多，且封膜站機台與模具必須搭配才能進行生產等限制。目前案例公司所進行的方式為先逐站規劃各站別之產品產量分配，接著規劃機台與模具配置，然而產品產量分配、機台配置及模具配置三者將互相影響，這樣的規劃方法分階段順序求解未必為整體的最佳，且會產生許多規劃的誤差。因此本研究提出方法來同步考量此產能組態規劃問題。
本研究用兩個架構來求解此問題，分別為混合整數規劃與兩階段架構之基因演算法結合線性規劃模式來進行規劃求解。混合整數規劃方法是進行同步之產品產量分配及機台配置與模具配置規劃，以改善公司分開求解之情況，而基因演算法結合線性規劃則為了解決混合整數規劃在產品種類變多時求解耗時的問題，將其整數變數之機台與模具配置使用基因演算法考量並修正產品分配之數學模式為線性規劃模式，最後用兩個方法驗證出，少於160種的產品數量時用混合整數規劃所求解可以有好的效率，但超過160種時則是用基因演算法結合線性規劃模式有一個較好的求解時間和不錯的求解績效，此兩種方法均可以在實務上給案例公司當作參考基準。

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