高填滿係數自我增益型主動式影像感測器與可調整式注入電流補償架構之研究

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研究生：	張賢鈞 Chang Hsien-Chun
論文名稱：	高填滿係數自我增益型主動式影像感測器與可調整式注入電流補償架構之研究 Tunable Injection Current Compensation Architecture for High Fill-factor Self-buffered Active Pixel Sensor
指導教授：	金雅琴 King Ya-Chin
口試委員:
學位類別：	碩士 Master
系所名稱：	電機資訊學院 - 電子工程研究所 Institute of Electronics Engineering
論文出版年：	2002
畢業學年度：	90
語文別：	英文
論文頁數：	106
中文關鍵詞：	互補式金氧半影像感測器、填滿係數、動態範圍、主動式影像感測器
外文關鍵詞：	CMOS Image Sensor, Fill-factor, Dynamic Range, Active Pixel Sensor
相關次數：	點閱：2 下載：0
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近幾年來，互補式金氧半影像感測器受到相當多的重視，因為相較於傳統的電荷耦合元件，互補式金氧半影像感測器具有低功率消耗、低成本、可隨機存取、以及可以和成熟且普及的互補式金氧半相同等特點。在目前影像感測應用與電子產品普及的今天，低價且與周邊電路整合性高的互補式金氧半影像感測器便成為重要的研究重點。
然而隨著製程的演進與元件尺寸的不斷縮小，互補式金氧半影像感測器的特性將會受到影響而變差。針對此問題，本論文提出一種新型具高填滿係數的主動式金氧半影像感測器結構，以及一個新的電路架構來改善感測器在先進製程中的表現。

新型元件稱為自我增強主動式影像感側器，其結構僅由一個PMOS電晶體和一個重置二極體所構成，並利用作為PMOS電晶體之基體的N型井以及P型基板來構成感光二極體。相較於傳統採用源汲區作為光二極體的主動式影像感測器，新型感測器具有較好的元件特性，尤其是應用在先進製程時；由模擬和實驗結果可以得知，在0.25μm的製程中，新型影像感側元件可以達到55%的高填滿係數、3.4V/lux-sec 的良好靈敏度、以及2.2伏特的高輸出範圍。

新式電路架構稱為可調整式注入電流補償架構，除了可以提高影像感測器的動態範圍外，並允許元件的輸出特性可以依照不同的應用與需求進行調整。由模擬和實驗結果可以知道，在良好的電路實現下，採用新式架構的影像感側器可增加將近40dB的動態範圍。有關新型影像感側元件與電路架構的設計考量與實驗結果，在本論文中都有詳盡的介紹與討論。

A high fill-factor self-buffered active pixel sensor and a tunable injection current compensation architecture for high dynamic range imager is proposed for scaled standard CMOS technology. The new cell including a photo diode formed by n-well and p-type substrate and an one-transistor output buffer shows better performance than conventional APS. Novel imager can achieve fill-factor of 55%, sensitivity of 3.4V/sec-lux, and large output swing 2.2V at VDD=3.3V for 0.25μm CMOS technology. Tunable injection current compensation architecture can improve dynamic range by as much as 40dB and can be tailored design to meet various application specifications. Dynamic range of up to 120dB is projected by simulation results. Experimental results of the new structure and simulated design of the circuit are discussed in this thesis.

LIST OF CONTENTS
ABSTRACT (ENGLISH) …………………………………………… i

ABSTRACT (CHINESE) …………………………………………… ii

ACKNOWLEDGEMENT ………………………………………………… iii

LIST OF CONTENTS ……………………………………………… iv

LIST OF FIGURES ………………………………………………… vi

LIST OF TABLES ………………………………………………… ix

CHAPTER1  INTRODUCTION

1.1 Background ………………………………………………… 1

1.2 Motivation ………………………………………………… 3

1.3 Organization ……………………………………………… 5

CHAPTER2  REVIEW OF CMOS IMAGE SENSORS

2.1 The CMOS Image Sensor …………………………………… 7

2.1.1 Passive Pixel Sensor ………………………………… 7

2.1.2 Active Pixel Sensor …………………………………… 8

2.1.3 Comparison of APS and PPS …………………………… 12

2.2 Image Sensor Characteristics ………………………… 13

2.3 Sensor Architecture and Readout Techniques ……… 15

2.3.1 Sensor Architecture …………………………………… 15

2.3.2 Readout Techniques …………………………………… 17

CHAPTER3  ACTIVE PIXEL SENSOR PERFORMANCE WITH PROCESS AND DEVICE SCALING TREND

3.1 Technology Scaling Trend and CMOS APS ……………… 27

3.1.1 Technology Scaling Trend …………………………… 27

3.1.2 Sensor Performance Trend …………………………… 30

3.2 Techniques for Imager Performance Improvement …… 31

3.2.1 Advanced CMOS Imager Techniques …………………… 32

3.2.2 N-well/P-sub Photodiode APS ………………………… 33

CHAPTER4  HIGH FILL-FACTOR SELF-BUFFERED APS

4.1 High Fill-factor Self-buffered Active Pixel Sensor 35

4.2 The Performance of the Novel Active Pixel Sensor… 37

4.3 Design Considerations and Trade-offs ……………… 39

CHAPTER5  TUNABLE INJECTION CURRENT COMPENSATION ARCHITECTURE FOR HIGH DYNAMIC RANGE

5.1 High Dynamic Range Approach …………………………… 50

5.2 Tunable Injection Current Compensation Architecture 52

5.3 Design Considerations and Optimization …………… 54

5.4 Summary ……………………………………………………… 57

CHAPTER6  EXPERIMENTAL RESULTS

6.1 Test-key Design and Measurement Setup ……………… 71

6.1.1 Test-key Design ………………………………………… 71

6.1.2 Measurement System ……………………………………… 71

6.1.3 Measurement Setup ……………………………………… 72

6.2 Experimental Results……………………………………… 73

6.2.1 Discussions for Experimental Results ……………… 73

6.2.2 Other Measurement Results …………………………… 75

6.2.3 Summary …………………………………………………… 75

CHAPTER7  CONCLUSIONS AND FUTURE WORKS

7.1 Conclusions ………………………………………………… 84

7.2 Future Works ……………………………………………… 85

REFERENCE ………………………………………………………… 94

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