本研究針對電子軟銲中的Sn-In-Ag三元系統，以實驗方法進行液相線投影圖的建構及Sn-20wt%In-2.8wt%Ag商用合金對Cu, Ni基材的界面反應觀察。
在Sn-20wt%In-2.8wt%Ag/Cu的界面反應部分，在250℃的液/固反應中，界面先生成扇貝狀的Cu6Sn5相，而隨反應時間增加後，開始有層狀的Cu3Sn相在Cu6Sn5相與Cu基材間生成，且由動力學分析得知，Cu6Sn5相的生長趨勢符合parabolic growth kinetic，而Cu3Sn相的生長趨勢較接近為linear kinetic。
而在固/固反應中，在100℃與150℃熱處理下界面只生成Cu6Sn5相，而在較低溫的100℃下，其生成相並無隨時間而有明顯增厚的現象，反而在靠近界面的銲料端生成許多塊狀的Cu6Sn5相；而在較高溫的150℃下，界面的Cu6Sn5相厚度與t1/2呈線性正比的關係，並可知反應為擴散控制。
在Sn-20wt%In-2.8wt%Ag/Ni的界面反應部分，在100℃熱處理1440小時，界面生成厚度約10μm 的Ni3Sn4相；而在150℃下，介金屬相的生長情形隨熱處理時間而變化，在反應剛開始時，生成散佈微小顆粒的層狀Liquid＋Ni3Sn4相。隨熱處理時間拉長，部分界面處開始產生塊狀的Ni3Sn4相，且在介金屬相中也可觀察到小塊的Ni3Sn4相散佈其中。最後，介金屬相完全轉變為緻密且均勻的Ni3Sn4相。而推測介金屬相變化的原因，應該是Ni與Sn的反應較慢，使剛開始的生成相含有較高比例的Sn與In，而Ni的含量隨熱處理時間增加，便逐漸生成為Ni3Sn4相。
在本研究之液相線投影圖中，共配置了18個合金組成，以金相分析及XRD繞射圖譜比對的實驗方法，確定了Sn-In-Ag三元合金之液相線投影圖中的(βSn)、γ、Ag2In、ζ及Ag3Sn的相區。

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