熱管用於電子熱傳相當廣泛，其概念是利用相變化時的潛熱，將熱大量的從熱管接觸熱源的一端(蒸發端)傳遞到散熱的另一端(冷凝端)。
發展平板式熱管(Flat Heat Pipe)應用在電子熱傳的優點，其一、大部分的熱管接為長條圓柱型，與平面的電子晶片接觸為一大問題，而平板則解決了此顧慮，其二、本實驗之平板式熱管內部為多流道設計，其用處在於可以增加內部液體容量、增加毛細力和使內部流體液氣分流，減少液氣相互之間的摩擦力。。在此所謂的平板式熱管並非一般市面上把許多條圓柱型熱管壓扁後接合相連，因此可以減少過多不必要的璧面相接和降低接觸熱阻，也大幅降低其重量與價格。
本實驗模擬大部分真實的電子散熱產品以水平放置為主，發熱源在平板式熱管之下，利用KAPTON電熱片模擬電子晶片的發熱，作為平板式熱管蒸發端的熱源，在冷凝端利用水冷的方式把熱量帶走，利用水冷的原因是為了增加平板式熱管兩端的溫差，使內部流體作動較為明顯，利於觀測。
本研究的主要目的有二。第一、了解毛細結構、內部流體種類(水、甲醇)，內部流體填充量和內部材質(純銅、銅粉燒結的毛細結構)對於平板式熱管效能的影響為何，進一步找出散熱效果最理想的組合。第二、觀察流體在平板式熱管內部的運動情形，與在平板式熱管外部量測所得的溫度分佈相互比較，解釋其運動情形和溫度之間有何關聯性。

Heat pipe has been widely used for the thermal management of electronic products. The concept lies in the fact that the latent heat derived from phase change can absorb the heat generation of the chips. As a result, the massive quantity of heat can be quickly transported from the evaporation region to the condensation region.
Advantages of flat heat pipe for the heat transfer of electrical devices are as follows. (1) Most of heat pipes are of cylindrical shape, which inherently has a contact problem with flat electronic chips. However, there is no such a drawback for flat heat pipes. (2) The volume of working fluid inside the flat heat pipe and the thermal contact resistance across the interface between chips and heat pipes can increases and decreases, respectively. Thus, both of the total weight and price are greatly reduced. It should be noted that the flat heat pipe adopted here is not the product found in the common market which is composed of several cylindrical heat pipes arranged in parallel with one another.
This experiment is placed horizontally to simulate the most situations of electronic products. The chip is altered by a KAPTON electroncaloric sheet served as a heat source, and the water jacket as a heat sink in our experiment. The water cooling is used in the condensation region to achieve a greater temperature difference between the ends of flat heat pipes and thereby to facilitate the experimental observation.
There are two primary objectives in this work. (1) The first one is to investigate the influence of capillary force, properties of working fluid and wick structures on the cooling limit of chips. (2) The second one is to observe the whole phenomena of working fluid inside flat heat pipes from a startup to a steady state. We hope to find out a suitable combination of flat heat pipe whose cooling capacity is better through the visualization of experiment.

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