摘要
近年來構裝技術之演進趨向輕、薄、短、小，使得構裝元件的尺寸、厚度及接腳間距亦隨之縮減，且封裝結構常為多層不同材料結構組成，因其材料間的熱膨脹係數(Coefficient of Thermal Expansion, CTE)不同所造成的熱應力與熱應變問題也將隨著元件尺寸的縮小而更趨敏感。

在封裝結構的熱應力、熱應變的研究中一般最常使用的方法為有限元素(Finite Element Method，FEM)模擬法，尤其是構裝初期開發階段以FEM來從事設計分析更是不可或缺。有限元素法雖能迅速的提供分析模型之答案，然有限元素法所提供之解答之正確性仍必須以一些基本之實驗量測來驗證。本研究的目的在於發展實驗驗證與數值分析模型並加以比對，並建立一套設計的方法學，進而對覆晶封裝結構等不同的封裝結構進行熱變形之參數式研究分析。

此外，由於底膠(Underfill)覆晶封裝結構(Flip Chip)中所使用的底膠通常為熱固性高分子材料，因此底膠覆晶封裝結構具不可重工性。一般而言底膠藉由毛細管作用填充於矽晶片與基板之間的間隙所需時間較，且底膠需要長時之烘烤以固化，因此製程時效不佳。有鑑於上述有底膠覆晶結構之缺點，本研究提出以附加限制層結構以取代底膠之覆晶封裝結構的新概念，以期避免底膠覆晶封裝結構之不可重工性與耗時製程並保有可接受之可靠性。最後，本研究中也針對無底膠附加限制層覆晶封裝結構進行參數式有限元素法之研究分析，並且用以探討Flip chip on board封裝結構的可靠度。本研究於進行參數式分析之前，將先行以三種覆晶實體結構如傳統有底膠覆晶封裝、無底膠覆晶封裝及具限制層之無底膠覆晶封裝進行實驗與有限元素分析之比對。於基本驗證完成後，本文將以相同之材料特性與方法進行對晶片、限制層、基板、主機板及底膠的材料特性（楊氏模數、熱膨脹係數）與幾何尺寸（大小、厚度、填膠外型 ）等參數進行討論，以瞭解這些設計參數對封裝結構的影響，進而完成新型具限制層無底膠覆晶結構之設計準則。

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