在現今的太陽能電池產業中，大量的使用矽晶片做為太陽能電池的基板，而將矽晶片輕薄化除了可減少成本，更可避免過度使用造成矽材料的短缺與能源的浪費。然而無論是在矽晶片的製造或輕薄化的過程中，都有可能使矽晶片表面產生缺陷，在缺陷處容易有應力集中的現象發生，且容易成為破壞的起始點。本研究利用有限單元分析軟體，首先探討裂縫物理參數對應力集中的影響，對不同的裂縫深度、裂縫尖端曲率半徑、有限單元分析軟體的單元類型以及單元形狀進行分析，接著探討奈米結構之太陽能矽晶片輕薄化後對機械強度之影響，最後進行金字塔奈米結構對表面缺陷處應力集中現象影響之研究，包含輕薄化前與輕薄化後之結果與討論。此外經由四點彎矩實驗證明奈米結構能有效增加矽晶片之機械強度，並且透過實驗來驗證模擬的結果。本研究所得到之結果能為矽晶片輕薄化以及使用奈米結構提高矽晶片機械強度之相關研究提供參考。

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