隨著微小型系統的廣泛使用，運用於微機電系統中之材料機械性質漸趨重要。本論文著重於在微電子以及微機電系統中應用廣泛之電鍍鎳薄膜的機械特性。我們提供了一套方法來對此薄膜進行機械性質之整合測試。此套方法適用於具有大形變量(> 5%)之薄膜並且能夠應用在具有不同厚度的試片上。
電鍍鎳薄膜之楊氏模數被視為電鍍溫度以及電流密度等製程參數的函數研究。根據這項觀點，我們在不同的電鍍溫度以及電流密度下準備了十三批試片。從1.4 μm 到 11.6 μm的可變沉積厚度中，其標稱尺寸寬度1000 μm，長度4000 μm之鎳薄膜的拉伸試片被用來進行測試。並且，鼓膜試片的直徑為500 和 750 μm。在40℃，0.22 ASD的環境下，4.73 μm厚的鎳薄膜其經由拉伸測試所得到的楊氏模數為39.72 GPa，經由鼓膜測試所得到的為198.78 GPa，經由奈米壓痕測試所得到的為263.48 GPa。在同樣環境下所量測到之降伏強度以及破壞強度分別為964.52 MPa以及1346.93 MPa。

Mechanical properties of MEMS materials are increasingly important with the wide use of miniaturized systems. The study is focused on the mechanical characterization of electroplated Nickel (Ni) thin films used in microelectronic and micro-electromechanical systems (MEMS) devices. We provide the method of integration testing of mechanical properties of thin films. This method is suitable for thin films with large strain (> 5%) and can be applied to samples with different thicknesses.
The Young’s modulus of an electroplated Nickel thin film has been investigated as a function of process variables, which are the plating temperature and current density. According to the cognition, we prepare thirteen batch of specimens in different plating temperatures and current densities. With a variable deposition thickness from 1.4 μm to 11.6 μm, tensile specimens of Ni thin film, with a gauge section 1000 μm wide and 4000 μm long were tested. And the diameters of bulge specimens are 500 and 750 μm. The measured Young’s modulus of 4.73 μm thick Ni thin film is about 39.72 GPa by tensile test, 198.78 GPa by bulge test and 263.48 GPa by nanoindentation test at 40℃, 0.22 ASD. In the same condition, the measured yield strength and breaking strength is 964.52 MPa and 1346.93 MPa, respectively.

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