本研究使用六標準差DMAIC（Define 定義、Measure 衡量、Analyze 分析、Improve 改善、Control 管制）的改善流程，針對晶圓背面研磨製程能力進行提升。六標準差專案團隊首先決定CTQ（critical-to-quality，關鍵品質特性），並執行MSA（measurement system analysis，量測系統分析）以確保在個案研究中獲得的數據。透過特性要因圖分析可能的因子後，利用優先矩陣表來確定關鍵因子。接著，採用田口方法尋找製程參數的最佳組合。當最佳製程參數導入量產後，該製程能力Cpk由1.08上升到2.60。最後，制定管制計畫表與後續使用樣本平均數和全距管制圖來監控製程。因為個案公司製程能力有突出表現而節省相關作業工時，並且達到車用客戶的要求而獲得額外的增加訂單，每個月專案效益合計共5,120萬新台幣。

This study applied Six-Sigma DMAIC improvement process to level up wafer backside grinding process capability. The Six Sigma team initially determined the CTQ (critical-to-quality) characteristics, and then performed MSA (measurement system analysis) to make sure that the data was collected properly in the case study. After analyzing the possible factors by Cause-and-Effect Diagram, the key factors were determined by running Prioritization Matrix. The Taguchi Methods were employed to find out the optimal combination of parameters. After implementing the optimal parameter settings to mass production, Cpk of the specific process increased from 1.08 to 2.60. The team then created a control plan and monitored the process by Xbar-R chart. Because of the outstanding performance of Cpk, the case company saves relevant working hours and secures additional orders from automotive customers, leading to a monthly project benefit of NTD 51.2 million.

英文文獻
1. Li, Z.-Q., Jing, X.-M., Jiang, F., and Zhang, W.-Q., 2014, “Modeling and simulation of silicon wafer backside grinding process,” 15th International Conference on Electronic Packaging Technology.
2. Breyfogle, III. F. W., 2003, Implementing Six Sigma: Smarter Solutions Using Statistical Methods, 2nd ed., New York: Wiley Europe
3. Su, C.-T., Hsiao, Y.-H., and Liu, Y.-L., 2011, “Enhancing the Fracture Resistance of Medium/Small-Sized TFT-LCDs Using the Six Sigma Methodology,” IEEE Transactions on components, Packaging and Manufacturing Technology, Vol. 2, pp. 149-164.
4. Stewart, R. A. and Spencer, C. A., 2006, “Six-sigma as a strategy for process im-provement on construction projects: a case study,” Construction Man. & Econ., Vol. 24, No. 4, pp. 339–348.
5. Kanyinda, K., Lazarus, J., and Olanrewaju, O., 2020, “Influence of Six Sigma DMAIC to Reduce Time Wasting of Line Supervisor in Production Manufacturing,” International Conference on Industrial Engineering and Engineering Management.
6. Su, C.-T. and Yeh, C.-Y., 2011, “Optimization of the Cu wire bonding process for IC assembly using Taguchi methods,” Microelectronics Reliability, Vol. 51, No. 1, pp. 53-59.
7. Dhemla P., Somani P., Swami B. L., Gaur A., 2022, “Optimizing the design of sintered fly ash light weight concrete by Taguchi and ANOVA analysis,” Materials Today: Proceedings. Vol. 62, Part 2, pp. 495-503.
8. Antony, J., Perry, D., Wang, C. and Kumar, M., 2006, “An application of Taguchi Method of Experimental Design For New Product Design and Development Process,” Assembly Automation, Vol.26, Is. 1, pp. 18-24.
9. Smetkowska, M. and Mrugalska, B, 2018, "Using Six Sigma DMAIC to improve the quality of the production process: a case study,” Information Sciences, Vol. 238, pp. 590-596.

 
中文文獻
1. 蘇朝墩，2009，六標準差，前程文化事業有限公司。
2. 劉文超等校閱，2003，半導體製造技術，滄海書局‧鼎隆圖書股份有限公司。
3. 翁偉智，2021，動態模擬與實驗測試於晶背研磨製程對矽晶圓/扇出型晶圓級封裝研磨所產生的彎曲與應力的探討，中山大學機械與機電工程研究所碩士論文。
4. 蔣雅婷，2014，應用六標準差改善IC載板金手指凸起問題，清華大學工業工程與工程管理研究所碩士論文。
5. 林家銘，2010，應用田口方法最佳化可撓式顯示器之光學白度特性，清華大學工業工程與工程管理研究所碩士論文。
6. 蘇朝墩，2013，品質工程：線外方法與應用，前程文化事業有限公司。
7. 蘇朝墩，2010，品質管理，前程文化事業有限公司。

網路資源
1. 研磨機台設備商Okamoto Machine Tool Works, Ltd.公司網頁（https://www.okamotoen.com/backgrinder）
2. 藍色膠帶供應商AI Technology, Inc.公司網頁（https://www.aitechnology.com/products/tapes/grinding-tape/）