本論文以發展可應用於可撓式電子元件之轉向壓印技術為目標。首先以塗佈F13TCS的方式對模具進行表面處理並進行相關之製程研究，降低模具表面能量使其在壓印之後能順利脫模。第一階段的壓印實驗以PMMA作為壓印材料，使用微米模具測試脫模劑之效果，並藉由改變旋轉塗佈壓印材料的轉速以及壓印溫度，利用光學顯微鏡、SEM及AFM觀察並分析不同線寬線間距之圖形區域的壓印結果來研究並確認壓印模式。找出最佳之壓印條件後，第二階段進一步以奈米模具壓印出線寬150nm之圖形，使用O2反應離子蝕刻去除殘留層後，再以電子束蒸鍍方式鍍上金/鈦，利用浮離技術(lift-off)在矽基底以及可撓式基板(polyimide,PI)上成功製作出線寬150nm的金線。由我們的研究成果可知，轉向壓印微影技術將可有效應用於可撓式電子元件之製作。

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